Semiconductor Chip Crack Detection via Charge Pattern Discoloration
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Solution Overview
Problem
There is a demand for detecting cracks generated in semiconductor chips during the process of separating wafers into individual chips or packaging them, as existing methods are not efficient in identifying and assessing the extent of cracks in semiconductor chips.
Innovation Solution
An apparatus is developed that includes a target layer with charging patterns, a charge sinking pattern, connecting patterns, a charger, an image detector, and a determination unit to detect color changes in the charging patterns, allowing for the identification of cracks through SEM imaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional methods are used to detect cracks in semiconductor chips, then the detection process is simple, but the detection precision and ability to identify crack extent are insufficient
Solution Approach 1:
The patent applies preliminary action by pre-charging the charging patterns before crack detection. The charging patterns are charged with electric charges in advance, and when a crack occurs, the charge distribution changes immediately, allowing for precise and rapid crack detection without requiring complex real-time charging mechanisms during the detection process itself.
Solution Approach 2:
The patent utilizes color changes in the charging patterns as detected by the image detector to identify crack locations. The determination unit analyzes color variations in the captured images of charging patterns, where color changes indicate charge leakage due to cracks, providing a simple yet effective visual detection method that improves precision without significantly increasing device complexity.
2Loss of information
If existing crack detection methods are used, then the process is quick, but the ability to assess crack extent and location is insufficient
Solution Approach 1:
The patent segments the detection system into distinct functional components: charging patterns distributed across the semiconductor chip, a charger for selective charging, an image detector for capturing charge distribution, and a determination unit for analyzing images. This segmentation allows each component to perform its function efficiently while collectively providing comprehensive crack location and extent information through the coordinated action of these divided elements.
Solution Approach 2:
The patent replaces complex mechanical or physical inspection methods with an electrical field-based detection system. By using electric charges and image detection to visualize crack locations and extents, the system eliminates the need for manual inspection or complex mechanical probing, thereby maintaining high productivity while significantly improving the information quality about crack locations and extents.
3Measurement precision
If charging patterns are used to detect cracks, then crack detection precision is improved, but the device complexity and manufacturing complexity increase
Solution Approach 1:
The patent merges the crack detection function with existing semiconductor chip structures by integrating charging patterns into the chip fabrication process. The charging patterns are formed alongside other chip components, and the detection system utilizes these pre-existing patterns, thereby improving crack detection precision without requiring entirely separate manufacturing processes or significantly increasing overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively detects cracks by identifying color changes in the charging patterns, enabling precise detection of crack locations and extent, thereby improving the yield and reliability of semiconductor chips.
Implementation Method 1
a charger for charging electric charges to the charging patterns
Implementation Method 2
an image detector for obtaining images of the charging patterns in which the electric charges are charged
Data Source
AI summary
An apparatus for detecting a crack of a semiconductor chip may include a crack sensor including a charging pattern disposed on a first surface of a target layer in which cracks are to be detected, a charge sinking pattern disposed on a second surface of the target layer, and a connecting pattern that electrically connects the charging pattern to the charge sinking pattern. The apparatus for detecting a crack may further include a charger for charging electric charges to the charging pattern, an image detector for obtaining an image of the charging pattern, and a determination unit that detects a discolored charging pattern from the image of the charging pattern and determines that a crack has occurred in a portion of the target layer in which the discolored charging pattern is located.