Chip Cutting Particle Removal via Electrostatic Ejection
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Solution Overview
Problem
Existing object cutting methods fail to reliably remove particles from cut sections of chips, which can attach to functional devices during transportation, despite techniques like destaticizing and ion air blowing, especially when a modified region is formed in the cut section.
Innovation Solution
The method involves electrically charging a first sheet with a plurality of chips separated on it, using a second sheet to oppose the first sheet, and generating an ion flow to eject particles from the cut sections onto the second sheet, ensuring they do not attach to functional devices. This is achieved by forming a modified region using laser light for cutting, which allows for controlled particle removal through ion flow manipulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If destaticizing or ion air blowing techniques are used during cutting, then particles can be removed from chip surfaces, but particles remaining on cut sections with modified regions are hard to remove
Solution Approach 1:
The first sheet is electrically charged in advance, before the chips are transported, in a state where the chips are separated from each other on the first sheet. This preliminary charging creates an electric field that actively ejects particles from cut sections, making particle removal effective even when modified regions are present on the cut sections.
Solution Approach 2:
The invention changes the physical state of the first sheet by electrically charging it, creating an electric field parameter that enables particle ejection. This parameter change allows particles to be actively removed from cut sections rather than relying on passive destaticizing or ion air blowing methods.
2Manufacturing precision
If particles are ejected from cut sections using electric charging, then chip cleanliness is improved, but additional equipment and process steps are required
Solution Approach 1:
The first sheet serves multiple functions: it supports the chips during cutting, maintains chip separation, and when electrically charged, actively ejects particles from cut sections. This multi-functionality reduces the need for additional specialized equipment while achieving particle removal.
Solution Approach 2:
The electrically charged first sheet automatically ejects particles from cut sections through the electric field it generates. The system uses its own electric charge to perform the particle removal function, eliminating the need for separate particle removal equipment or additional processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents particles from attaching to functional devices by ensuring they are ejected and collected, maintaining chip cleanliness and functionality.
Implementation Method 1
at least the first sheet is electrically charged in a state where a plurality of chips obtained by cutting a planar object to be processed along a line to cut are separated from each other on the first sheet. This electric action causes particles remaining on cut sections of the chips to eject therefrom
Implementation Method 2
The modified region to become a cutting start point is formed by irradiating the object with laser light such as to cause multiphoton absorption or other kinds of optical absorption in the object
Implementation Method 3
a dischargeable second ion flow is generated at least in an area between the chip and second sheet
Data Source
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AI summary
An object cutting method which can reliably remove particles remaining on cut sections of chips is provided. An expandable tape 23 is electrically charged in a state where a plurality of semiconductor chips 25 obtained by cutting a planar object to be processed along a line to cut are separated from each other on the expandable tape 23. This electric action causes particles remaining on cut sections of the semiconductor chips 25 to eject therefrom even when a molten processed region is formed in the cut sections. Therefore, particles remaining on the cut sections of the chips 25 can reliably be removed.