Chip Design Method for Module Interface Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing complexity of digital integrated circuit systems leads to complex circuit designs, making it challenging to efficiently improve design efficiency and reduce the chip design cycle.
Innovation Solution
A chip design method that involves determining a to-be-designed second device in a second module, arranging it in the first module to align interfaces, performing physical design by analyzing wiring and time sequence convergence, and copying the designed device in the first module to the second module for axisymmetric alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional separate physical design methods are used for devices in different modules, then design flexibility is maintained, but design time increases and design efficiency decreases
Solution Approach 1:
The patent applies preliminary action by performing physical design on a first device in a first module before finalizing the design of the second device in the second module. The first device is designed in advance with placeholder structures for interfaces, allowing subsequent design steps to proceed without waiting for complete information about interconnected devices. This reduces overall design time while maintaining design flexibility.
Solution Approach 2:
The patent segments the chip design into multiple independent modules (first module, second module, etc.) that can be designed separately but interconnected through defined interfaces. Each module's physical design can proceed independently once interface specifications are established, enabling parallel design work and improving overall productivity without compromising system integration.
2Reliability
If interface alignment is performed early in the design process, then design defects can be detected earlier, but the complexity of arranging devices increases
Solution Approach 1:
The patent performs interface alignment and connection relationship determination in advance during the preliminary physical design stage. By establishing interface positions and connection paths before completing device placement, the method enables early detection of potential design defects while organizing complexity into manageable steps rather than dealing with all complexity simultaneously.
Data Source
AI summary
A chip design method includes determining a to-be-designed second device in a second module, arranging a second device in the first module, connecting the interface of the first device in the first module and the interface of the second device in the first module, performing physical design by analyzing physical wiring and time sequence convergence between the first device in the first module and the second device, copying the second device in the first module after the physical design as a designed second device in the second module, and disconnecting the interface of the first device in the first module from the interface of the second device in the first module and connecting the interface of the first device in the first module to an interface of the designed second device in the second module.


