Semiconductor Chip Detachment Using Image-Based Prepeeling Control
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Solution Overview
Problem
The detachment of semiconductor chips from a foil during the prepeeling phase is challenging as it requires precise control to avoid damage and ensure efficient processing, with existing methods lacking real-time monitoring and optimal parameter determination for rapid yet safe detachment.
Innovation Solution
A method involving perpendicularly illuminated semiconductor chips, where image recording and analysis are used to determine and set the duration of prepeeling steps, allowing for real-time monitoring and adjustment of the detachment process using a die ejector with liftable plates or a displaceable carriage, ensuring that the chip is not damaged and detached efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the prepeeling process is performed rapidly, then the productivity is improved, but the semiconductor chip may break apart and the reliability deteriorates
Solution Approach 1:
The patent implements real-time monitoring of the prepeeling process using sensors to detect the detachment status of semiconductor chips. The system adjusts the prepeeling speed dynamically based on feedback signals, ensuring that chips are detached at optimal speeds that prevent breaking while maintaining high overall productivity.
Solution Approach 2:
The prepeeling mechanism employs dynamic control where the detachment speed and force are adjusted in real-time during the process. The system transitions from static, fixed-speed prepeeling to dynamic, adaptive prepeeling that responds to actual chip detachment conditions, preventing breakage while optimizing throughput.
2Reliability
If the prepeeling process is performed slowly, then the chip integrity is maintained, but the productivity deteriorates
Solution Approach 1:
Real-time feedback mechanisms monitor chip detachment status and automatically adjust prepeeling speed. When chips are detected to be detaching properly, the system increases speed; when resistance or potential breakage is detected, speed is reduced, optimizing both integrity and productivity.
Solution Approach 2:
The system dynamically changes process parameters such as prepeeling speed, force, and timing based on real-time conditions. This allows the process to operate at high speeds when safe and slow down only when necessary, resolving the contradiction between speed and integrity.
3Device complexity
If manual parameter setting is used for prepeeling, then the device complexity is low, but the manufacturing precision deteriorates
Solution Approach 1:
The system performs self-calibration and automatic parameter optimization through integrated sensors and control algorithms. The prepeeling parameters are automatically determined based on real-time measurements of chip properties and detachment behavior, eliminating the need for complex manual setup while achieving high precision.
Solution Approach 2:
Manual mechanical parameter adjustment is replaced with automated electronic control systems that use sensors, processors, and actuators. This substitution enables precise digital control of prepeeling parameters without the complexity and imprecision of manual mechanical adjustment.
4Manufacturing precision
If real-time monitoring is implemented, then the manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The monitoring system is designed with multi-functionality, where sensors and control units serve multiple purposes: monitoring chip detachment, detecting process anomalies, adjusting prepeeling parameters, and providing feedback for optimization. This reduces overall system complexity compared to dedicated single-function monitoring components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise and efficient detachment of semiconductor chips from the foil, minimizing the risk of damage and optimizing the detachment process by using image processing to determine optimal parameters and monitor the detachment in real-time, thereby improving throughput and chip integrity.
Implementation Method 1
illuminating a semiconductor chip to be removed with light which impinges substantially perpendicularly onto the surface of the semiconductor chip
Implementation Method 2
the semiconductor chip is detached at least partly from the foil by the die ejector... firstly at least one area of the semiconductor chip remains sticked to the foil and is bent and afterwards detaches from the foil
Data Source
AI summary
The invention relates to the prepeeling phase of methods for detaching a semiconductor chip from a foil. According to a first aspect, the invention relates to the determination of time periods, which each defines a duration of a prepeeling step. In a setup phase, the following steps are carried out for each prepeeling step:Initiating the method step;Repeating the two stepsRecording of an image of the semiconductor chip and assignment of a time period to the image which has passed since the initiation of the prepeeling step, andChecking whether in the image a peripheral region of the semiconductor chip is darker than a predetermined brightness value;until the check leads to the result that no peripheral region of the semiconductor chip is darker than the predetermined brightness value.According to a second aspect, the detachment of the semiconductor chip from the foil is monitored in realtime.