Chip Detecting Structure Using Micro Heaters for Pre-Bond Screening
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Solution Overview
Problem
The existing methods for manufacturing and detecting light-emitting diode (LED) chips face difficulties in optical detection and reduced detection efficiency due to the need for cutting chips from a wafer before detection.
Innovation Solution
A chip-detecting method and structure that uses a combination of low-temperature and high-temperature soldering materials, with micro heaters to cure the soldering materials and establish electrical connections between the chips and a detecting structure, allowing for the differentiation of good and bad chips before bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If chips are cut from wafer before detection, then individual chip detection is possible, but detection efficiency is reduced
Solution Approach 1:
The patent applies preliminary action by performing detection on chips while they are still mounted on the wafer substrate, before any cutting or separation occurs. The detecting structure is positioned adjacent to the wafer substrate to detect electrical properties of multiple chips simultaneously in their original state, eliminating the need for post-cutting detection and thereby maintaining high detection efficiency while achieving individual chip detection capability
Solution Approach 2:
The detecting structure is designed with multi-functionality to handle both wafer-level detection and individual chip detection without requiring separate detection systems. By detecting electrical properties (such as forward voltage, reverse leakage current) of multiple chips simultaneously while they remain on the wafer, the system achieves universal detection capability that maintains productivity while enabling precise individual chip assessment
2Productivity
If all chips are processed together, then manufacturing efficiency is high, but quality control of individual chips is reduced
Solution Approach 1:
The patent performs preliminary quality assessment of individual chips while they are still grouped on the wafer substrate. By detecting electrical properties of each chip individually before any processing or cutting occurs, the system maintains manufacturing efficiency (processing chips in bulk) while achieving precise individual chip quality control. This allows good chips to be identified and separated from bad chips at an early stage
Solution Approach 2:
The detecting structure implements segmentation by independently detecting electrical properties of each chip on the wafer substrate. Each chip's electrical characteristics (forward voltage, reverse leakage current, etc.) are measured separately and individually evaluated, enabling precise quality assessment of each chip while maintaining the efficiency of batch processing. The system can then selectively separate good chips from bad chips based on individual detection results
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the selection and bonding of only good chips on a circuit substrate, improving detection efficiency and ensuring the quality of the chip-bonding process by allowing for pre-detection and separation of good chips before bonding.
Implementation Method 1
respectively curing the low-temperature soldering material groups by heating of the micro heater groups
Data Source
AI summary
A chip-detecting method, a chip-detecting structure and a chip-carrying structure are provided. The chip-detecting method includes providing a chip-detecting structure including a plurality of micro heater groups, a chip-carrying structure for carrying a plurality of chips, and a plurality of soldering material groups disposed between the chip-carrying structure and the chip-detecting structure; placing the chip-carrying structure and the chip-detecting structure adjacent to each other, so that each of the soldering material groups simultaneously contact the chip-carrying structure and the chip-detecting structure; respectively curing the low-temperature soldering material groups by heating of the micro heater groups, so that the chips are electrically connected to the chip-detecting structure respectively through the low-temperature soldering material groups that have been cured; and then detecting the chips so as to divide the chips into a plurality of good chips and a plurality of bad chips.