Semiconductor Chip Structure for Crack-Stopped Dicing
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Solution Overview
Problem
Dicing failures such as cracks or chipping often occur during the singulation of semiconductor chips, adversely affecting the semiconductor elements and reducing yield.
Innovation Solution
Incorporation of a structure body, such as columnar sections or plate-like sections, between the semiconductor element and the stacked body to act as a crack stopper, along with a recess in the interlayer insulating film to terminate cracks or film peeling, and the use of a resin layer to seal the semiconductor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dicing is performed to singulate semiconductor chips, then productivity is improved through chip separation, but dicing failures such as cracks or chipping occur reducing yield
Solution Approach 1:
A groove is formed in the substrate before dicing to create a predetermined crack path. This preliminary structural modification guides cracks to propagate along the groove rather than through the semiconductor element, preventing dicing failures while maintaining efficient chip separation
Solution Approach 2:
The groove acts as an intermediary structure between the dicing blade and the semiconductor element. It provides a controlled path for crack propagation, mediating the force application during dicing to prevent direct damage to the semiconductor element while still achieving chip separation
2Reliability
If substrate thickness is increased to prevent cracks, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The substrate is segmented by forming a groove that divides the potential crack path into a controlled channel. This segmentation allows the substrate to maintain adequate thickness for strength while the groove provides a designated path for crack propagation, avoiding the need for overly thick substrates
3Productivity
If dicing is performed quickly to improve productivity, then manufacturing speed increases, but dicing failures increase
Solution Approach 1:
The groove is pre-formed in the substrate before dicing, establishing a predetermined crack path in advance. This allows rapid dicing to be performed without compromising quality, as the groove ensures cracks follow the intended path even at high speeds
Solution Approach 2:
The potential harmful effect of rapid dicing causing uncontrolled cracks is converted into a benefit by using the groove to channel the crack energy. The speed-induced stresses that would normally cause random cracking are redirected along the groove path, ensuring clean separations even at high dicing speeds
Data Source
AI summary
A semiconductor device according to an embodiment includes a semiconductor chip, a semiconductor element, a stacked body, and a structure body. The semiconductor chip includes a first surface, a second surface, and a side surface between the first surface and the second surface. The semiconductor element is provided in the center of the semiconductor chip when viewed from the normal direction of the first surface. The stacked body is provided at the outer peripheral end portion of the semiconductor chip when viewed from the normal direction and includes a plurality of first layers and a plurality of second layers alternately stacked in the normal direction. The structure body is provided in at least a part between the semiconductor element and the side surface when viewed from the normal direction and extending from a position higher than the stacked body to a position lower than the stacked body.