Chip Dicing Groove Width Sequencing to Prevent Edge Cracking
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Solution Overview
Problem
The formation of a groove shape resembling a fang at the end portions of processed grooves during laser cutting of substrates with films leads to decreased transverse rupture strength and potential cracking of chips.
Innovation Solution
A chip manufacturing method involving two distinct laser beam widths to form first and second processed grooves with varying widths, preventing the formation of fang-like shapes at the groove ends.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single laser beam is applied to form a processed groove, then the groove formation is simple and fast, but the groove bottom develops fang-like shapes at end portions causing decreased transverse rupture strength and chip cracking
Solution Approach 1:
The single laser beam processing is segmented into two distinct processing steps: a first laser beam forms a preliminary groove, and a second laser beam refines the groove bottom. This segmentation allows each laser beam to have optimized parameters for its specific function, preventing fang-like shape formation at the groove bottom end portions while maintaining manufacturing efficiency.
Solution Approach 2:
The first laser beam performs preliminary groove formation before the second laser beam refines the groove bottom. This preliminary action creates a prepared structure that the second laser beam can then optimize, ensuring the groove bottom has the proper shape to prevent fang-like defects while maintaining overall process efficiency.
2Device complexity
If a single laser beam is used for groove formation, then the processing step is simple, but the groove bottom shape becomes irregular with fang-like portions
Solution Approach 1:
The laser processing is divided into two sequential steps using different laser beams with different beam widths. The first laser beam creates the initial groove structure, while the second laser beam with a different beam width refines the groove bottom shape. This segmentation achieves precise groove bottom formation without excessive complexity in the overall device.
3Ease of manufacture
If the cutting blade contacts the film during cutting, then the cutting process is straightforward, but the film peels off and damages devices
Solution Approach 1:
A processed groove is formed in advance using laser beams before the cutting blade performs the actual cutting. This preliminary action creates a protective groove structure that prevents the cutting blade from directly contacting and peeling the film, thereby maintaining device integrity while keeping the cutting process itself simple and straightforward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents the formation of fang-like shapes at the groove ends, thereby enhancing the transverse rupture strength and reducing the likelihood of chip cracking.
Implementation Method 1
a first processed groove forming step of forming a first processed groove having a first width in a direction of the width by applying a first laser beam along the planned dividing line
Implementation Method 2
a second processed groove forming step of forming a second processed groove having a second width different from the first width in the direction of the width by applying a second laser beam along the planned dividing line
Data Source
AI summary
A chip manufacturing method includes a processed groove forming step of forming a processed groove by removing a part of a film along a planned dividing line, and a dividing step of forming a plurality of chips by dividing a substrate along a bottom of the processed groove after the processed groove forming step. The processed groove forming step includes a first processed groove forming step of forming a first processed groove having a first width by applying a first laser beam along the planned dividing line, and a second processed groove forming step of forming a second processed groove having a second width different from the first width by applying a second laser beam along the planned dividing line after the first processed groove forming step.