Semiconductor Chip Dicing Grooves for Crack-Controlled Separation
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Solution Overview
Problem
The existing laser dicing process for semiconductor chips often results in non-dicing failures, such as reduced dicing power at corner portions leading to layer delamination or chipping, due to inadequate control over the dicing process.
Innovation Solution
The method involves forming dicing grooves in the active layer of a semiconductor substrate that intersect at points where first and second dicing lines meet, and using modified patterns aligned along these lines to propagate cracks and separate the substrate into chips, thereby reducing the risk of delamination and chipping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If laser dicing is used to replace blade dicing, then substrate consumption is reduced, but non-dicing failures occur due to reduced dicing power at corner portions
Solution Approach 1:
The patent applies preliminary action by forming dicing grooves at corner portions before the main dicing process. These grooves pre-concentrate stress and prepare the material structure for cleaner separation, preventing delamination and chipping that would otherwise occur during laser dicing of corner regions.
Solution Approach 2:
The patent implements local quality by creating dicing grooves specifically at corner portions with different geometry and depth characteristics compared to the main dicing lines. This localized structural modification addresses the specific vulnerability of corner regions to delamination while maintaining the overall laser dicing process efficiency.
2Strength
If dicing power is increased to prevent delamination, then corner portion integrity improves, but chipping and unwanted direction failures increase
Solution Approach 1:
The patent applies segmentation by dividing the dicing process into distinct components: dicing grooves at corner portions and main dicing lines. This segmentation allows each region to be optimized independently - grooves prevent delamination through stress concentration while main lines perform the primary separation, avoiding the need to excessively increase overall dicing power.
Solution Approach 2:
The dicing grooves act as intermediaries that mediate the stress distribution during laser dicing. They provide a controlled pathway for crack propagation and stress release, preventing both delamination (by concentrating stress) and chipping (by providing a defined separation path) in corner portions.
3Stability of the object's composition
If dicing grooves are formed to prevent delamination, then corner portion stability improves, but manufacturing process complexity increases
Solution Approach 1:
The patent replaces the mechanical blade dicing system with a laser-based system that forms dicing grooves through optical energy. This substitution eliminates the need for physical contact and complex mechanical positioning, reducing overall process complexity while achieving improved corner stability through the groove structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the occurrence of dicing failures by concentrating stress at specific points, allowing for precise control over the dicing process and improving the separation of semiconductor chips without delamination or chipping.
Implementation Method 1
dicing the substrate into semiconductor chips by propagating cracks into the substrate from the modified patterns
Data Source
AI summary
A method of manufacturing a semiconductor chip and a semiconductor device. The method of manufacturing the semiconductor chip includes a process of dicing a substrate. The substrate includes an active layer and an organic layer on the semiconductor base. Dicing grooves that are extended to face each other along first dicing lines from points, at which the first dicing lines and second dicing lines along which the substrate is to be diced intersect, are formed by recessing some parts of the active layer. Modified patterns are formed within the semiconductor base. The substrate is diced into semiconductor chips by propagating cracks into the substrate from the modified patterns.