Integrated Chip Die Carrier Exchanger for Automated Transfer
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Solution Overview
Problem
The manual transfer of integrated chip (IC) die between die trays and die boats is time-consuming, costly, and prone to contamination and damage in high-volume fabrication facilities.
Innovation Solution
An integrated chip processing tool with a die exchanger that automatically transfers IC die between a die tray and a die boat, utilizing robotic elements to align and rotate the trays and boats for efficient and precise transfer, thereby reducing transfer time and minimizing risks of contamination and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual transfer of IC die is used, then operation flexibility is maintained, but transfer time increases and productivity decreases
Solution Approach 1:
The die exchanger system performs automatic transfer operations without requiring manual intervention. The robotic elements autonomously align, rotate, and transfer IC die between die trays and die boats, enabling the system to serve itself and eliminating dependence on human operators for this repetitive task.
Solution Approach 2:
Manual mechanical transfer operations are replaced with an automated robotic system. The die exchanger uses robotic elements with alignment mechanisms and rotation capabilities to perform the transfer, substituting human hand operations with programmed mechanical automation that achieves higher speed and consistency.
2Reliability
If manual transfer of IC die is used, then equipment complexity is reduced, but contamination and damage risks increase
Solution Approach 1:
The die exchanger acts as an intermediary device between the die tray and die boat, providing a controlled transfer environment. The robotic elements and alignment mechanisms create an isolated transfer path that minimizes exposure to external contamination sources while maintaining systematic control over the transfer process.
Solution Approach 2:
The transfer operation is extracted from the manual process and isolated into a dedicated automated die exchanger unit. This separation allows the transfer function to be independently optimized with specific protective features and controlled environments, removing it from the broader manual handling context that introduces contamination risks.
3Manufacturing precision
If automatic transfer is implemented, then transfer precision is improved, but device complexity increases
Solution Approach 1:
The die exchanger system is divided into distinct functional modules: robotic elements for grasping and moving die, alignment mechanisms for positioning, and rotation capabilities for orientation changes. This segmentation allows each component to be optimized for its specific function while contributing to overall transfer precision through coordinated operation.
Data Source
AI summary
The present disclosure, in some embodiments, relates to an integrated chip processing tool. The integrated chip processing tool includes a first transfer module and a second transfer module. The first transfer module has a first robotic arm disposed within a housing. The first transfer module is configured to receive a single and unitary first die tray configured to hold a plurality of integrated chip (IC) die and to concurrently transfer all of the plurality of IC die held by the single and unitary first die tray to a single and unitary die boat. The second transfer module has an additional robotic arm disposed within the housing and configured to concurrently transfer all of the plurality of IC die from the single and unitary die boat to a single and unitary second die tray.