Chip-Level Integrated Diffusers for Two-Axis Beam Profile Control
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Solution Overview
Problem
Existing light sources with diffusers require package-level integration, which is costly and limits the integration of uniform illumination profiles in specific applications, as the diffuser is separate from the optical source and not integrated at the chip level.
Innovation Solution
A light source with a substrate and an epitaxy layer that includes an optical element and a diffuser with refractive or diffractive lenslets pseudorandomly arranged, allowing for chip-level integration of the diffuser directly on the substrate to control the optical signal's profile over two axes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a diffuser is included in a package at some distance away from the optical source, then the light source can control the profile of the optical signal, but the integration cost increases due to package-level integration requirements
Solution Approach 1:
The patent merges the diffuser with the substrate to form an integrated chip-level structure. The diffuser is positioned in direct contact with or very close to the optical source on the substrate, eliminating the need for separate package-level integration. This combining of the diffuser and substrate into a single integrated unit reduces device complexity while maintaining profile control precision.
2Manufacturing precision
If package-level integration is used for the diffuser, then the optical signal profile can be controlled, but the manufacturing cost increases
Solution Approach 1:
By integrating the diffuser directly onto the substrate at the chip level rather than using separate package-level assembly, the patent reduces manufacturing steps and associated costs. The diffuser and substrate are manufactured as a single integrated component, eliminating additional packaging operations and reducing overall manufacturing complexity and cost.
3Device complexity
If the diffuser is integrated at chip level on the substrate, then the device complexity and manufacturing cost are reduced, but the ability to control the optical signal profile over two axes becomes more challenging
Solution Approach 1:
The patent employs an array of lenslets with varying focal lengths arranged in a pseudorandom pattern on the substrate. Each lenslet is designed with specific local optical properties (different focal lengths) to collectively control the optical signal profile in both horizontal and vertical directions. This local variation in lenslet properties enables precise two-axis profile control despite the integrated chip-level structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces costs associated with package-level integration and facilitates the integration of light sources into various applications by enabling precise control of the optical beam profile, enhancing the light source's performance and versatility.
Implementation Method 1
one or more of the lenslets is refractive or diffractive
Implementation Method 2
one or more of the lenslets is refractive or diffractive
Implementation Method 3
an epitaxy layer positioned on the first surface of the substrate
Data Source
AI summary
An embodiment includes a light source. The light source may include a substrate and a diffuser. The substrate may include a first surface and a second surface. The second surface may be opposite the first surface. The diffuser may be carried by the substrate. The diffuser may be configured to receive an optical signal from the substrate after the optical signal propagates through the substrate and to control a particular profile of a resultant beam of the optical signal over two axes after the optical signal propagates through the integrated diffuser.