Chip Thermal Dissipation Structure via Dual-Case Heat Redirection
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Solution Overview
Problem
The increasing heat densities in microminiaturized electronic devices due to higher working frequencies of chips pose a challenge for effective thermal dissipation, as traditional active heat dissipation methods are unsuitable for lightweight and compact designs, and passive heat dissipation methods struggle with thermal conductivity limitations, leading to elevated temperatures and reduced device performance and lifespan.
Innovation Solution
A chip thermal dissipation structure that includes a first and second case contacting the chip back and print circuit board, respectively, with heat-conducting materials, redirecting thermal energy flow to reduce heat resistance and junction temperatures, thereby enhancing thermal conductivity and reducing the impact of heat on adjacent chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If passive heat dissipation means is used to meet light, thin and small requirements, then device weight and size are reduced, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent introduces a heat dissipation case as an intermediary component between the chip and the external environment. The case includes a heat dissipation chamber that receives thermal energy from the chip and transfers it to the external environment, acting as a mediator to improve heat dissipation efficiency without requiring active cooling components.
Solution Approach 2:
The patent changes the thermal conductivity parameter by filling the heat dissipation chamber with heat dissipation material having specific thermal conductivity properties. This parameter change enables effective heat transfer from the chip through the case to the external environment, resolving the contradiction between lightweight design and heat dissipation efficiency.
2Productivity
If chip working frequency is increased to improve product competitiveness, then processing performance is improved, but heat density increases
Solution Approach 1:
The patent extracts the heat energy generated by high-frequency chip operation from the device interior by directing it into a dedicated heat dissipation chamber. This separation allows the chip to operate at high frequencies for improved performance while the extracted thermal energy is managed independently through the heat dissipation case and material.
3Volume of moving object
If multiple chips are integrated in compact package, then device size is reduced, but heat flow interference between chips increases
Solution Approach 1:
The patent segments the heat dissipation function by providing individual heat dissipation chambers for each chip within the integrated package. Each chip has its own dedicated chamber that receives and manages its thermal energy independently, preventing heat flow interference between adjacent chips while maintaining compact device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces heat resistance and junction temperatures, efficiently dissipating thermal energy, which lowers the working temperature of electronic devices, improves performance, and extends their usage lifetime by redirecting thermal energy flow through high-conductivity paths.
Implementation Method 1
heat-conducting materials, redirecting thermal energy flow to reduce heat resistance and junction temperatures, thereby enhancing thermal conductivity
Data Source
AI summary
Disclosed is a chip thermal dissipation structure, employed in an electronic device comprising a first chip having a first chip face and a first chip back, comprising chip molding material, covering a lateral of the first chip; a first case, contacting the first chip back; a packaging substrate, connecting with the first chip face via first bumps; and a print circuit board, having a first surface and a second surface and connecting with the packaging substrate via solders. The chip thermal dissipation structure further comprises a second case, contacting the second surface. The thermal energy generated by the first chip is conducted toward the first case via the first chip back and toward the second case via the first chip face, the first bumps, the packaging substrate, the solders and the print circuit board.