Chip Electrode Concave-Convex Structure Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Chip resistors and other chip parts face issues with electrode peeling due to inadequate adhesion strength and incorrect recognition during mounting, leading to instability and errors in assembly.
Innovation Solution
The introduction of a chip part design featuring a substrate with an element region and electrode region, an insulating film with internal concave/convex structures, and an electrode with anchor and external concave/convex structures to enhance adhesion and recognition, including a wiring film and specific materials like Al—Cu alloy and Ni—Pd—Au laminated structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the electrode surface is made flat to simplify manufacturing, then the manufacturing process is easier, but the electrode cannot be recognized correctly by the mounter device when the chip part is held at an angle
Solution Approach 1:
The patent applies curvature by forming concave-convex structures on the electrode surface instead of keeping it flat. These curved features (protrusions and recesses) enable light reflection from multiple angles, allowing the mounter device's camera to detect the electrode regardless of the chip's orientation during mounting.
2Device complexity
If the electrode is made with a simple flat structure to reduce complexity, then the device structure is simpler, but the adhesion strength between electrode and substrate is insufficient causing peeling
Solution Approach 1:
The patent transitions from a two-dimensional flat electrode surface to a three-dimensional structured surface by forming concave-convex patterns. This dimensional change increases the surface area and creates mechanical interlocking features (protrusions fitting into recesses) that significantly enhance adhesion strength while preventing electrode peeling.
3Measurement precision
If external concave-convex structures are added to the electrode surface to improve recognition, then the recognition rate increases, but the device complexity increases
Solution Approach 1:
The patent makes the electrode structure multi-functional by designing the concave-convex features to simultaneously serve two purposes: (1) providing mechanical interlocking for enhanced adhesion strength, and (2) creating light-reflecting patterns for improved optical recognition by the mounter device. This eliminates the need for separate structures for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly increases the adhesion strength of the electrode to the substrate and improves recognition rates during mounting, reducing errors and ensuring stable chip part assembly.
Implementation Method 1
an anchor portion that enters a concave portion of the internal concave/convex structure
Implementation Method 2
it is possible to reflect light from a light source in all directions
Data Source
AI summary
A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.