Chip Electronic Component Internal Electrode Connection Structure
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Solution Overview
Problem
The existing chip-type electronic components face limitations in the arrangement of internal electrodes due to restricted terminal electrode size and space, leading to reduced capacitance and potential joint strength issues, especially in small-sized components, where internal electrodes cannot be arranged beyond the terminal electrode range and may experience projection, causing adhesion deterioration and conduction failures.
Innovation Solution
The design incorporates external and internal connection conductors that connect internal electrodes to terminal electrodes indirectly, allowing for increased arrangement flexibility and joint strength by setting the number of internal connection conductors to be smaller than internal electrodes, thus minimizing projection influence and enhancing contact area with the ceramic element body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the terminal electrode size is reduced to achieve smaller component size, then the component size is reduced, but the arrangement number of internal electrodes is limited and capacitance cannot be increased
Solution Approach 1:
The patent divides the connection path into multiple segments: internal electrodes connect to external connection conductors on the ceramic surface, which then connect to terminal electrodes through internal connection conductors. This segmentation allows internal electrodes to extend beyond the terminal electrode area, increasing arrangement number without increasing component size.
Solution Approach 2:
The patent utilizes the ceramic surface area (external connection conductors) as an intermediate dimension between internal electrodes and terminal electrodes. By arranging external connection conductors on the ceramic surface that extends beyond the terminal electrode footprint, the design achieves higher electrode arrangement density without increasing the component's external dimensions.
2Quantity of substance
If internal electrodes are arranged beyond the terminal electrode range to increase capacitance, then the arrangement number of internal electrodes is increased, but electrical connection cannot be established with the terminal electrodes
Solution Approach 1:
The patent introduces external connection conductors as intermediary elements on the ceramic surface and internal connection conductors as mediators within the ceramic body. These intermediaries bridge the gap between internal electrodes positioned beyond the terminal electrode range and the terminal electrodes, ensuring reliable electrical connection while maintaining design flexibility.
3Strength
If the number of internal connection conductors is reduced to minimize projection influence, then joint strength is improved, but electrical connection paths are reduced
Solution Approach 1:
The patent merges multiple internal electrode connections into fewer internal connection conductors that collect currents from multiple external connection conductors. This consolidation reduces the number of internal connection conductors needed, minimizing projection issues and improving joint strength while maintaining adequate electrical connection through the merged pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances design freedom for internal electrode arrangement, improves joint strength between terminal electrodes and the ceramic element body, and allows for increased capacitance without inhibiting mounting ability or size reduction, while maintaining electrical insulation and mechanical integrity.
Implementation Method 1
a first external connection conductor which is arranged on an external surface of the ceramic element body and to which the plurality of first internal electrodes are connected; a second external connection conductor which is arranged on the external surface of the ceramic element body and to which the plurality of second internal electrodes are connected
Implementation Method 2
a phenomenon in which the internal electrodes grow so as to project from the surface of the ceramic element body, because of a difference between a rate at which metal forming the internal electrodes diffuses into metal forming the terminal electrodes and a rate at which the metal forming the terminal electrodes diffuses into the metal forming the internal electrodes
Data Source
AI summary
A chip-type electronic component has: a ceramic element body; a plurality of first and second internal electrodes arranged in the ceramic element body so as to be opposed at least in part to each other; a first external connection conductor to which the plurality of first internal electrodes are connected; a second external connection conductor to which the plurality of second internal electrodes are connected; first and second terminal electrodes; a first internal connection conductor arranged in the ceramic element body and connecting the first external connection conductor and the first terminal electrode; and a second internal connection conductor arranged in the ceramic element body and connecting the second external connection conductor and the second terminal electrode. The number of the first internal connection conductor is set to be smaller than the number of the first internal electrodes and the number of the second internal connection conductor is set to be smaller than the number of the second internal electrodes.