Chip Electronic Component End Face Electrode Gas Reduction
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Solution Overview
Problem
Conventional chip-shaped electronic components experience issues with perforation and solder splashing during high-temperature soldering due to gases generated from end face electrode layers, leading to poor conduction and mounting challenges in high-density electronic component assemblies.
Innovation Solution
A chip-shaped electronic component with end face electrode layers containing carbon powder, whisker-like inorganic fillers coated with conductive films, and flake-like conductive powders, along with an epoxy resin of specific molecular weight, is developed to reduce perforation and solder splashing, featuring a production process that includes screen printing, firing, and electroplating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional end face electrode layers containing mixed material with conductive particles and resin are used, then manufacturing is simplified, but gas generation during soldering causes perforation and solder splashing
Solution Approach 1:
The patent changes the chemical composition parameters of the end face electrode layers by specifying exact proportions of conductive powder (70-90 wt%), inorganic filler (5-20 wt%), and resin (1-10 wt%). This parameter optimization reduces gas generation during soldering while maintaining electrical conductivity, thereby improving reliability without sacrificing ease of manufacture
Solution Approach 2:
The patent creates a composite material system for end face electrode layers combining conductive powder, inorganic filler, and resin in specific ratios. This composite structure reduces gas generation during high-temperature soldering processes while maintaining electrical conductivity, resolving the contradiction between manufacturing simplicity and reliability
2Reliability
If nickel-plated layers and solder-plated layers are formed on end face electrode layers, then external electrode functionality is achieved, but perforation and solder splashing occur during heating
Solution Approach 1:
The patent applies preliminary action by optimizing the end face electrode layer composition before forming the nickel and solder plated layers. By pre-configuring the electrode layer with reduced gas-generation materials, the subsequent plating processes and soldering operations proceed without perforation or splashing, eliminating harmful factors while maintaining reliability
Solution Approach 2:
The patent changes the compositional parameters of the end face electrode layers to contain 70-90 wt% conductive powder, 5-20 wt% inorganic filler, and 1-10 wt% resin. This parameter optimization reduces gas generation during heating, preventing perforation and solder splashing of the plated layers, thereby eliminating harmful factors while maintaining electrode functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes weight reduction and solder splashing, ensuring reliable conduction and improved manufacturing efficiency, with enhanced electrode strength and coatability, while maintaining cost-effectiveness.
Implementation Method 1
an epoxy resin-containing solution containing an epoxy resin having a molecular weight of 1,000 to 80,000
Implementation Method 2
a whisker-like inorganic filler coated with a conductive film
Data Source
AI summary
A chip-shaped electronic component includes a substrate and an end face electrode layer provided on an end face of the substrate, in which the end face electrode layer contains a mixed material. The mixed material includes as a conductive particle, a carbon powder, a whisker-like inorganic filler coated with a conductive film, and a flake-like conductive powder. Additionally, an epoxy resin has a weight-average molecular weight between 1,000 and 80,000.