Semiconductor Chip Common Electrode Plate for Low-Resistance Cooling
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Solution Overview
Problem
As power semiconductor devices become more complex, the challenge of efficiently connecting semiconductor chips to electrodes and wires while maintaining low resistance and high heat dissipation properties becomes increasingly difficult, particularly in applications like in-vehicle inverters.
Innovation Solution
The use of common electrode plates that are electrically connected to the semiconductor chips in common and wires on a substrate, eliminating the need for wire bonding, and utilizing sintered materials and plated metals for secure electrical connections, along with a heat-dissipation fin and encapsulation for thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect semiconductor chips to electrodes, then electrical connections can be established, but the resistance increases and heat dissipation efficiency decreases
Solution Approach 1:
The patent removes the wire bonding intermediate connection from the electrical connection path. Semiconductor chips are directly mounted on the common electrode plate, eliminating the wire bonds that caused high resistance and poor heat dissipation. This extraction of the problematic intermediate element directly resolves the contradiction between connection reliability and energy loss.
Solution Approach 2:
The patent merges the electrode function and heat dissipation function into a single integrated common electrode plate. The common electrode plate serves both as the electrical connection substrate and as a heat dissipation component with integrated fins, combining multiple functions that were previously separated into different elements (wires, electrodes, heat sinks).
2Adaptability or versatility
If multiple separate components are used for electrical connections and heat dissipation, then functional requirements are met, but device complexity increases and manufacturing becomes difficult
Solution Approach 1:
The common electrode plate is designed as a universal component that performs multiple functions simultaneously: it serves as the electrical connection substrate, the heat dissipation structure (with integrated fins), and the mounting platform for semiconductor chips. This multi-functionality eliminates the need for separate wire bonds, individual heat sinks, and multiple electrode layers, significantly reducing device complexity.
Solution Approach 2:
The patent combines previously separate components (electrode plate, heat dissipation fins, mounting structure) into a single integrated common electrode plate assembly. This merging reduces the number of parts and simplifies the manufacturing process while maintaining all necessary functional capabilities for electrical connection and thermal management.
3Reliability
If conventional connection methods are used, then electrical connections can be established, but the number of parts increases and uniform thickness cannot be achieved
Solution Approach 1:
The patent extracts and removes the excessive intermediate components (wire bonds, separate mounting structures) that increased part count and prevented uniform thickness. By directly mounting chips on the common electrode plate, the structure achieves simplicity and uniformity while maintaining reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for low-resistance electrical connections and enhanced heat dissipation, reducing the number of parts and achieving a uniform thickness, while maintaining high thermal conductivity and electrical conductivity.
Implementation Method 1
utilizing sintered materials and plated metals for secure electrical connections
Implementation Method 2
utilizing sintered materials and plated metals for secure electrical connections
Implementation Method 3
maintaining high thermal conductivity and electrical conductivity
Data Source
AI summary
A semiconductor device according to the present embodiment includes a first insulating substrate having a first surface and a second surface opposite the first surface. First and second electrically conductive layers are provided on a side of the first surface. A plurality of semiconductor chips each have a third surface facing the first surface, a fourth surface opposite the third surface, a first electrode provided on the third surface, and a second electrode provided on the fourth surface. The first electrode is electrically connected to the first electrically conductive layer. A common electrode plate has a fifth surface facing the fourth surface, is electrically connected to the second electrodes of the semiconductor chips in common, and is electrically connected to the second electrically conductive layer. A second insulating substrate is provided on a side of the second surface of the first insulating substrate.