Chip Electronic Component Outer Electrode Area Optimization
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Solution Overview
Problem
Existing chip-type monolithic ceramic capacitors face challenges in preventing inclination relative to a circuit board during mounting and the formation of cracks in solder due to increased stress from temperature changes, particularly when the height of solder fillets is elevated.
Innovation Solution
The electronic component features a substantially rectangular parallelepiped body with outer electrodes that extend over specific portions of the end and bottom surfaces, with the area of these electrode portions ranging from 6.6% to 35.0% of the respective end surfaces, preventing inclination and crack formation by optimizing the distribution and size of solder fillets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the height of solder fillets is increased to prevent inclination of the electronic component relative to the circuit board, then the component stability is improved, but the stress on the solder increases leading to crack formation
Solution Approach 1:
The outer electrode is designed with different area ratios at different locations: the end surface portion has an area ratio of 6.6% to 35.0% while the bottom surface portion has an area ratio of 15.0% to 65.0%. This local differentiation optimizes both component stability during mounting and reduces solder stress during temperature changes, preventing crack formation while maintaining proper positioning.
2Stability of the object's composition
If the area of the outer electrode end surface portion is increased to improve component stability, then the fillet height increases and inclination is prevented, but the solder stress increases causing crack formation
Solution Approach 1:
The patent specifies precise parameter ranges for the outer electrode areas: the end surface portion area ratio is controlled at 6.6% to 35.0% and the bottom surface portion area ratio at 15.0% to 65.0%. These parameter optimizations balance the competing requirements of preventing component inclination while minimizing solder stress and crack formation during thermal cycling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents the electronic component from inclining relative to the circuit board and avoids crack formation in the solder, as demonstrated by experimental results showing zero inclination and crack incidence within the specified area range of 6.6% to 35.0%.
Implementation Method 1
stress caused in the solder due to changes in temperature
Implementation Method 2
The fillets pull the monolithic ceramic capacitor 500 towards the negative side in the z-axis direction due to surface tension, thereby pressing the monolithic ceramic capacitor 500 against the circuit board
Data Source
AI summary
In an electronic component, a body includes top and bottom surfaces, first and second end surfaces, and first and second lateral surfaces. A first outer electrode partially extends over the bottom surface and the first end surface without being disposed on the top surface, the second end surface, and both the lateral surfaces. A second outer electrode partially extends over the bottom surface and the second end surface without being disposed on the top surface, the first end surface, and both the lateral surfaces. An area of a first end surface portion of the first outer electrode disposed on the first end surface and area of a second end surface portion of the second outer electrode disposed on the second end surface are in a range of about 6.6% to about 35.0% of area of the first and second end surfaces, respectively.