Semiconductor Chip Electrode Layout for Lower Wire Heating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor devices face heat management issues due to long wires, which generate excessive heat and can lead to wire fusion and reduced power cycle lifetime, limiting the reliability of the device.
Innovation Solution
A semiconductor device design that includes a semiconductor chip with an output electrode portion and multiple wires connected to each electrode region, with the number of wires per region determined by the region's area to ensure the current through each wire is within a predetermined value, reducing heat generation and preventing wire peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the number of wires is increased to reduce current per wire, then heat generation is reduced, but the bonding area limitation prevents sufficient wire placement
Solution Approach 1:
The output electrode portion is divided into multiple electrode regions, and each electrode region is connected to different wires. This segmentation allows the current to be distributed across multiple connection points within the bonding area, effectively reducing the current per wire without requiring additional bonding area.
Solution Approach 2:
Different electrode regions are assigned different numbers of wires based on their respective positions and current requirements. This local optimization ensures that each wire operates within safe current limits while maximizing the utilization of the available bonding area.
2Ease of operation
If long wires are used to connect distant electrode regions, then connectivity is achieved, but heat generation increases due to wire resistance
Solution Approach 1:
By segmenting the output electrode into multiple regions and connecting them via multiple wires, the patent creates multiple parallel current paths. This reduces the current through each individual wire, thereby reducing resistive heating while maintaining connectivity to all electrode regions.
3Temperature
If wire current is reduced by increasing wire count, then heat generation decreases, but wire fusion and peeling risks increase due to temperature cycling
Solution Approach 1:
The segmentation of the output electrode into multiple regions with separate wire connections distributes the thermal and mechanical stress across multiple bonding points. This prevents excessive temperature cycling at any single connection point, reducing the risk of peeling and fusion while maintaining reliable power cycle lifetime.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces heat generation and enhances the power cycle lifetime and reliability of the semiconductor device by optimizing wire connections based on electrode region size and location.
Implementation Method 1
when a current flows through a wire, the wire generates heat due to its resistance
Data Source
AI summary
A semiconductor device includes a first semiconductor chip including an output electrode portion on a front surface thereof, the output electrode portion including a plurality of electrode regions, each of which is provided at a respective position of the output electrode portion, and a plurality of wires, each electrode region being connected to a different one or more wires among the plurality of wires, through which a respective amount of output current is output. A total number of the different one or more wires connected to each electrode region is set depending on the respective position of the electrode region of the output electrode portion, so that the electrode region has a respective current amount per wire that is equal to or less than a respective predetermined value.