Chip Electronic Device Hydrogen Barrier Electrode
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Solution Overview
Problem
Conventional chip electronic components, such as multi-layer ceramic capacitors, face reliability degradation due to electrolytic plating processes, where active hydrogen enters the internal electrodes, causing volume expansion and residual stress, especially when the internal electrodes are made of Ni, and there is a need for smaller and thinner components.
Innovation Solution
A chip electronic component with a protective layer formed by physical vapor deposition or chemical vapor deposition methods, comprising first metal grains with high hydrogen storage capacity and second metal grains with low hydrogen diffusion coefficients, preventing hydrogen entry during electrolytic plating, and featuring a multi-layer structure for improved reliability and size reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrolytic plating is used to form the external electrode, then the solder wettability is improved and solder dissolution is prevented, but active hydrogen enters the internal electrode causing volume expansion and reliability degradation
Solution Approach 1:
A protective layer made of Pd (palladium) or Pd alloy is introduced as an intermediary between the external electrode and the internal electrode. This protective layer acts as a barrier that prevents active hydrogen generated during electrolytic plating from penetrating into the internal electrode, thereby eliminating the harmful effect while maintaining the benefits of electrolytic plating.
Solution Approach 2:
The external electrode is segmented into multiple functional layers: an outer plating layer (formed by electrolytic plating) and an inner protective layer (made of Pd or Pd alloy). This segmentation allows each layer to perform its specific function - the outer layer provides solder wettability and protection, while the inner layer prevents hydrogen penetration.
2Volume of moving object
If the external electrode is made thinner for size reduction, then the component size is reduced, but the electrode becomes more difficult to fabricate and may compromise reliability
Solution Approach 1:
The protective layer is formed by controlling deposition parameters to achieve an optimal thickness that balances hydrogen barrier performance with overall component size reduction. By adjusting deposition conditions and layer composition, the electrode can be made thinner while maintaining fabrication ease and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective layer effectively prevents active hydrogen from entering the internal electrodes, reducing product degradation and enabling the production of smaller, more reliable chip electronic components by absorbing and trapping hydrogen, thus minimizing stress and deformation.
Implementation Method 1
a protective layer which is formed on an outer surface of the first electrode layer by a physical vapor deposition method or a chemical vapor deposition method
Implementation Method 2
a protective layer which is formed on an outer surface of the first electrode layer by a physical vapor deposition method or a chemical vapor deposition method
Implementation Method 3
Active hydrogen generated by this electrolysis of water may enter the internal electrode through the external electrode. The hydrogen occluded in the internal electrode may cause a volume expansion of the internal electrode
Implementation Method 4
forming a single or a plurality of plating layers by electrolytic plating
Implementation Method 5
electrolysis of water in a plating solution is caused by the current that was not used for forming the plating film
Data Source
AI summary
Provided is a chip electronic device that has an increased reliability with a small size. A chip electronic component has a main body made of a ceramic having an internal electrode therein. Provided on the main body is an external electrode that is made of a first electrode layer on the main body, a conductive protective layer on the first electrode layer, and a second electrode layer on the conductive protective layer formed by electrolytic plating. The conductive protective layer prevents hydrogen from diffusing into the main body during the electrolytic plating.