Chip-Embedded Composite Structure for Uniform EBL Spin-Coating
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Solution Overview
Problem
Chiplets with small surface areas cannot be directly spin-coated and photolithography area is wasted during fixation in electron beam lithography (EBL), leading to uneven spin-coating and exposure accuracy issues.
Innovation Solution
A chip embedded composite is prepared by arranging a composite structure with a substrate, conductive layer, and chip array, encapsulating with a protective layer, and curing with a polymer solution to create a flat surface for even spin-coating, maximizing lithography area utilization and ensuring electrical conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chiplets with small surface area are used for EBL, then the lithography area utilization is improved, but the spin-coating uniformity deteriorates due to height difference between chiplet surface and bottom surface
Solution Approach 1:
The patent transitions from a two-dimensional flat substrate to a three-dimensional composite structure by embedding chiplets within a polymer matrix. This dimensional change allows the chiplet array to maintain a flat outer surface while accommodating the height differences of individual chiplets internally, thereby achieving both high lithography area utilization and uniform spin-coating.
Solution Approach 2:
The patent creates a composite material structure consisting of chiplets embedded in a polymer matrix. This composite structure combines the functional properties of chiplets with the planarizing properties of the polymer material, enabling the surface to be flat enough for uniform spin-coating while maintaining high chiplet density for maximum lithography area utilization.
2Reliability
If chiplets are fixed on mechanical platform with heat-resistant tape, then the positioning stability is improved, but the lithography area is wasted due to tape coverage
Solution Approach 1:
The patent merges the fixation function with the structural support function by integrating chiplets into a unified polymer matrix. This combination eliminates the need for separate heat-resistant tape fixation, as the polymer matrix itself provides both structural support and positioning stability, thereby preventing lithography area waste.
Solution Approach 2:
The patent extracts the heat-resistant tape from the system and replaces it with a polymer matrix that performs the same fixation function. By removing the tape, the lithography area is no longer covered by non-lithographic materials, allowing maximum area utilization while maintaining positioning stability through the embedded chiplet structure.
3Productivity
If multiple chiplets are arranged on substrate, then the area utilization is improved, but the electrical conduction deteriorates due to gaps between chiplets
Solution Approach 1:
The patent uses a conductive polymer matrix as a composite material that simultaneously fills the gaps between chiplets and provides electrical conduction pathways. This composite structure maintains close spacing between chiplets for high area utilization while the conductive polymer ensures reliable electrical connectivity across the chiplet array.
Solution Approach 2:
The patent changes the electrical conductivity parameter of the surrounding matrix material to compensate for the gaps between chiplets. By selecting a polymer with appropriate conductive properties, the system maintains electrical conduction reliability while keeping chiplets closely packed to maximize lithography area utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for even spin-coating of chiplets, maximizing lithography area use, improving yield and reducing waste, with high operational tolerance and conductivity for electron beam lithography.
Implementation Method 1
encapsulating and curing the composite structure and the protective layer by using a polymer solution
Data Source
AI summary
The present application relates to the technical filed of semiconductor chip nanofabrication, provides a method for preparing a chip embedded composite for electron beam lithography. The preparation method includes: providing a composite structure, the composite structure including a first substrate, a conductive layer disposed on a surface of the first substrate and a chip array disposed on a surface of the conductive layer away from the first substrate; arranging a protective layer on an outer surface of the chip array, where the protective layer covers the chip array; encapsulating and curing the composite structure and the protective layer by a polymer solution; removing the protective layer to obtain the chip embedded composite.