Chip-Embedded PCB Heat Dissipation Member Design
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Solution Overview
Problem
Existing printed circuit boards (PCBs) with embedded chips face challenges in heat dissipation, leading to malfunction and degradation due to inadequate heat dissipation from electronic components, particularly in multi-functional electronic devices with increased connectivity and communication frequencies.
Innovation Solution
A chip-embedded printed circuit board (PCB) design featuring a base substrate with circuit patterns, an embedded electronic component, and a heat dissipation member made of conductive materials like copper or aluminum, along with a ball pad for electrical connectivity, to effectively dissipate heat generated by the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electronic components are embedded in PCB with molding materials and resin, then device integration is achieved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent introduces a heat dissipation member that extends vertically from the PCB surface in a third dimension, rather than attempting to dissipate heat laterally within the planar PCB structure. This vertical extension creates additional heat dissipation pathways and increases the effective heat dissipation surface area, resolving the contradiction between integrated embedding and heat dissipation capability.
Solution Approach 2:
The heat dissipation member acts as an intermediary structure between the embedded electronic component and the external environment. It provides a dedicated thermal pathway that mediates heat transfer from the component through the molding material to the outside, preventing heat accumulation while maintaining the embedded structure.
2Temperature
If heat dissipation structure is added to embedded chip PCB, then heat dissipation function is improved, but device complexity increases
Solution Approach 1:
The heat dissipation member is merged with the existing PCB structure and molding material system. Rather than adding a completely separate heat dissipation device, the solution integrates thermal management functionality into the existing package structure, reducing overall device complexity while improving heat dissipation.
Solution Approach 2:
The heat dissipation member serves multiple functions: it provides thermal pathways for heat dissipation, maintains structural integrity of the package, and can serve as a mounting surface for additional components. This multi-functionality reduces the need for separate dedicated heat dissipation devices, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat dissipation from embedded chips, enhancing the reliability and performance of semiconductor packages by using materials with excellent heat and electrical conductivity, thereby addressing the heat management issues in PCBs.
Implementation Method 1
a heat dissipation member installed on an exposed surface of the electronic component to dissipate heat generated from the electronic component to the outside
Data Source
AI summary
A chip-embedded printed circuit board (PCB), a semiconductor package using the PCB, and a manufacturing method of the chip-embedded PCB. The semiconductor package using a chip-embedded printed circuit board (PCB) includes upper and lower semiconductor packages having a package on package (PoP) structure, wherein the lower semiconductor package includes a base substrate including predetermined circuit patterns formed therein; an electronic component electrically connected to the circuit pattern and embedded in the base substrate such that one surface thereof is exposed to an upper surface of the base substrate; and a heat dissipation member installed on an exposed surface of the electronic component to dissipate heat generated from the electronic component to the outside.