Chip-Embedded Voltage Regulators for Power Delivery Loss Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a challenge in delivering power to electronic components with specific voltage and current requirements, particularly at lower voltages and higher currents, which existing power converters struggle to efficiently manage due to increased losses over longer distances.
Innovation Solution
The implementation of chip-embedded integrated voltage regulators (CEIVRs) that modify electrical power using parallel configurations of chip-embedded voltage regulators, inductors, and power switches, reducing current loss by delivering power over shorter distances within a package, and utilizing thin-film inductors and gallium nitride power switches for efficient power conversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If power is delivered over longer distances using existing power converters, then power can be delivered to electronic components, but power delivery losses increase significantly
Solution Approach 1:
The power delivery system is segmented into multiple stages: an external power converter delivers power to the package, and then chip-embedded voltage regulators (CEIVRs) perform final voltage conversion at the point of load within the package. This segmentation allows the long-distance power delivery to occur at higher voltage/lower current, while the short-distance internal delivery occurs at optimized voltages, minimizing total power losses.
Solution Approach 2:
The patent transitions from a single-plane power delivery architecture to a three-dimensional integrated architecture where CEIVRs are embedded within the package substrate in close proximity to the processor. This vertical integration reduces the physical distance and trace length for power delivery, thereby reducing I²R losses while maintaining design flexibility.
2Loss of energy
If chip-embedded voltage regulators are used to deliver power over shorter distances, then power delivery losses are reduced, but device complexity increases
Solution Approach 1:
Multiple functional components are merged into the CEIVR integrated circuit: voltage regulation, current limiting, thermal management, and control logic are combined into a single chip-embedded device. This integration reduces the overall system complexity compared to using separate discrete components while achieving the same power delivery optimization goals.
Solution Approach 2:
The CEIVR is designed as a universal power management device that can operate in multiple modes (voltage regulation, current limiting, thermal throttling) and serve different processing units within the same package. This multi-functionality reduces the need for multiple specialized components, thereby simplifying the overall system architecture.
3Productivity
If high current density is achieved in chip-embedded voltage regulators, then power delivery efficiency is improved, but thermal performance challenges increase
Solution Approach 1:
The CEIVR incorporates thermal sensors and control logic that continuously monitor temperature and adjust power delivery parameters in real-time. When thermal thresholds are approached, the system dynamically reduces current or adjusts voltage levels to maintain safe operating temperatures, enabling sustained high current density operation without thermal runout.
Solution Approach 2:
The package design includes pre-configured thermal management features such as heat sinks, thermal vias, and airflow channels positioned to optimize heat dissipation from the CEIVRs before excessive temperatures develop. This preliminary thermal management infrastructure enables the system to handle high current density loads more effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces power delivery losses, allows for flexible power distribution to meet diverse component specifications, and achieves high current density while maintaining efficiency and thermal performance, enabling reliable operation of high-power electronic devices.
Implementation Method 1
an inductor coupled to the chip-embedded circuitry
Implementation Method 2
a plurality of power switches configured to modify electrical power
Data Source
AI summary
One or more chip-embedded integrated voltage regulators (“CEIVR's”) are configured to provide power to a circuit or chip such as a CPU or GPU and meet power delivery specifications. The CEIVR's, circuit or chip, and power delivery pathways can be included within the same package. The CEIVR's can be separate from the circuit or chip.