Chip-Level Error Correction Tables for Accurate IC Measurements

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Integrated circuits face variations in output due to practical limitations in circuit design or architecture, leading to inaccuracies that affect market acceptance, as users expect devices to function according to published specifications.

Innovation Solution

A method for generating error correction values, which are stored in a nonvolatile memory as an error correction table, allowing for chip-by-chip measurement corrections by calculating and storing offset and gain errors, enabling the host processor to correct measurement inaccuracies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If circuit design or architecture is simplified for ease of manufacture, then manufacturing cost and complexity are reduced, but measurement accuracy and output consistency deteriorate

Engineering Contradiction:
Improvecircuit design simplicityVSAvoidoutput accuracy
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent segments the accuracy improvement into two independent parts: (1) the base circuit design which can be simple and easy to manufacture, and (2) the error correction table which handles accuracy corrections separately. This allows the circuit itself to remain simple while achieving high measurement accuracy through the added correction layer.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The error correction table acts as an intermediary between the simple circuit output and the desired accurate result. Instead of making the circuit complex, the patent introduces this intermediate correction layer that compensates for manufacturing variations and achieves the required measurement precision.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If circuit design is optimized for cost reduction, then manufacturing cost decreases, but device accuracy and specification compliance worsen

Engineering Contradiction:
Improvemanufacturing costVSAvoidspecification compliance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent performs preliminary characterization of each chip's errors during manufacturing and stores correction values in the error correction table before the device reaches the customer. This preliminary action ensures that each device is pre-configured with its specific correction factors, guaranteeing specification compliance without requiring complex high-precision circuits.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes the approach from fixing physical circuit parameters to adjusting operational parameters through software-based correction. By storing correction values in the error correction table and applying them during operation, the system achieves high reliability and specification compliance while using simpler, lower-cost circuit designs.

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If chip-by-chip customization is implemented to improve accuracy, then measurement precision improves, but manufacturing complexity and time increase

Engineering Contradiction:
Improvechip accuracyVSAvoidmanufacturing throughput
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The patent implements a self-service approach where each chip automatically identifies its own errors during manufacturing and generates its own correction values, which are then stored in its dedicated error correction table. This eliminates the need for complex manual calibration processes and enables high-speed automated chip-by-chip customization.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent transforms the manufacturing process from a time-consuming manual calibration operation to a fast automated parameter programming operation. By changing the correction values in the error correction table through electronic programming rather than physical adjustment, the system achieves high measurement precision while maintaining high manufacturing throughput.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS7890832B2Method for accuracy improvement allowing chip-by-chip measurement correction
Publication Date: 2011.02.15 INTERSIL AMERICAS INC
  • US7890832B2 patent drawing
  • US7890832B2 patent drawing
  • US7890832B2 patent drawing

AI summary

A method for allowing measurement corrections on a chip-by-chip basis. Error correction values are generated responsive to the input value to a circuit of the calibrated integrated circuit chip and to a measured value from the circuit of the calibrated integrated circuit chip. The error correction values are stored within an error correction table within a nonvolatile memory of the integrated circuit chip.