Chip Fill Pattern Steganography for Counterfeit Authentication
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Solution Overview
Problem
Existing chip authentication techniques are not sufficiently secure against counterfeit chips and may provide weak evidence in litigation, leading to revenue loss, performance issues, and legal liabilities.
Innovation Solution
Incorporating a coded pattern of dummy fill shapes with steganographically embedded information into semiconductor chip structures, decodable into a binary integer based on observable differences, maintained as proprietary information for authentication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical sensing and on-chip functional components are used for authentication, then authentication capability is provided, but security against counterfeit chips is insufficient
Solution Approach 1:
The patent uses optical copying/imaging to create a visual representation of the fill pattern on the chip. A camera or imaging system captures an image of the fill pattern, which is then processed to extract authentication data. This optical copying approach allows authentication without electrical contact and creates a permanent visual record that can be used as evidence
Solution Approach 2:
The patent employs variations in the fill pattern's visual characteristics (analogous to color changes) to encode authentication information. The fill pattern uses different densities, arrangements, or configurations that can be visually distinguished and decoded, providing a visual authentication mechanism that is difficult to replicate
2Reliability
If electrical sensing is used for authentication, then authentication results are obtained, but the evidence is weak for litigation
Solution Approach 1:
The patent creates a permanent visual copy of the authentication pattern through optical imaging. This visual record can be captured, stored, and presented as concrete evidence, unlike transient electrical measurements. The image serves as tangible proof that can be analyzed and verified in legal proceedings
Solution Approach 2:
The fill pattern is pre-configured during chip manufacturing with specific authentication characteristics. The pattern is designed in advance to contain encoded information that will later be visually captured and decoded, providing a predetermined authentication mechanism that leaves no ambiguity during verification
3Ease of manufacture
If standard fill patterns are used, then manufacturing simplicity is maintained, but authentication security is compromised
Solution Approach 1:
The patent applies a specialized authenticated fill pattern only in specific regions of the chip where authentication is required, while other areas use standard patterns. This localized approach maintains manufacturing simplicity for the majority of the chip while providing enhanced security in critical authentication zones
Solution Approach 2:
The authenticated fill pattern uses asymmetric or non-uniform configurations that differ from standard symmetric fill patterns. This asymmetry makes the pattern more difficult to replicate and provides unique visual characteristics that can be decoded for authentication, while still being manufacturable using standard lithography processes
Data Source
AI summary
A disclosed chip structure includes a coded pattern of dummy fill shapes with steganographically embedded information. The coded pattern is in a specific area of the chip, is a modified instance of a known pattern, and is decodable into a binary integer based on observable differences between the coded pattern and the known pattern at corresponding locations with the patterns. The location of the specific area containing the coded pattern, the decode cipher and the binary integer can be maintained as proprietary information (e.g., by a technology company or semiconductor foundry). Chip authentication can be made by a party with the proprietary information. Alternatively, the binary integer could be a means of conveying confidential information to a party that has been provided with the decode cipher and the location of the specific area containing the coded pattern. Also disclosed are system and method embodiments for designing and manufacturing the chip.