Chip on Film Package Integrating Display and Touch Chips
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Solution Overview
Problem
The existing manufacturing processes for display devices with touch screen panels and AMOLED display devices require separate mounting of display panel driving chips and touch panel sensor chips, increasing the number of components and processes, which complicates the design and reduces the flexibility of the devices.
Innovation Solution
A chip on film package is introduced, featuring a flexible base film with through holes and wirings that connect display panel driving chips and touch panel sensor chips on opposing surfaces, allowing for a single package to integrate both chips and reduce the overall component count, while maintaining electrical connectivity and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate mounting processes are used for display panel driving chip and touch panel sensor chip, then each chip can be independently connected to its respective panel, but the number of components and manufacturing processes increases
Solution Approach 1:
The patent merges the display panel driving chip and touch panel sensor chip into a single integrated package structure. Both chips are mounted on opposite surfaces of the same base film, which is connected to both the display panel and touch panel. This combining approach reduces the number of separate components while maintaining reliable electrical connectivity through the integrated wiring system on the base film.
Solution Approach 2:
The base film serves multiple functions simultaneously: it acts as a substrate for mounting both the display panel driving chip and touch panel sensor chip, provides electrical wiring connections for both chips, and serves as a flexible interconnection medium between the display panel and touch panel. This multi-functionality reduces component count while maintaining system reliability.
2Reliability
If separate mounting processes are used for display panel driving chip and touch panel sensor chip, then each chip can be independently connected to its respective panel, but the manufacturing process becomes more complex
Solution Approach 1:
The patent combines both chip mounting operations into a single integrated manufacturing process. The display panel driving chip and touch panel sensor chip are mounted together on the base film in one process sequence, rather than requiring separate mounting steps. This reduces manufacturing complexity while ensuring reliable electrical connections for both chips through the integrated wiring system.
3Adaptability or versatility
If multiple separate chips and components are used, then functional requirements can be met, but the device thickness and weight increase
Solution Approach 1:
The patent merges multiple separate chips into a single integrated package mounted on one base film. This consolidation reduces the overall weight of the device by eliminating redundant substrates, adhesives, and structural elements that would be required if the chips were mounted separately on different panels.
Solution Approach 2:
The patent uses a flexible base film as the mounting substrate for both chips, which reduces the overall thickness and weight compared to rigid separate mounting structures. The thin film nature of the base film allows for lightweight construction while maintaining mechanical support and electrical connectivity for both the display panel driving chip and touch panel sensor chip.
Data Source
AI summary
A chip on film package includes a flexible base film having a first surface and a second surface opposite to each other that includes at least one through hole therein, a plurality of wirings disposed on the first surface and the second surface of the base film, respectively, that include a first lead and a second lead connected to each other through the at least one through hole, and a display panel driving chip and a touch panel sensor chip, each mounted on any one of the first surface and the second surface of the base film, wherein at least one of the display panel driving panel and the touch panel sensor chip is electrically connected to the first and second leads.