Chip-on-Film Package Layout for Smaller Silicon Display Substrates
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Solution Overview
Problem
Current chip on package designs face challenges in miniaturization and productivity due to the large size of silicon substrates required for mounting display driving chips, which affects economic efficiency and the ability to reduce the size of the display apparatus.
Innovation Solution
The design includes a silicon substrate with a display panel and a base film where the display driving chip is mounted on the base film instead of the substrate, allowing for a reduced silicon substrate size, with a connector and driving printed circuit board electrically connected to facilitate signal transfer between chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the display driving chip is mounted on the silicon substrate, then the chip can be electrically connected to the display panel, but the silicon substrate size increases reducing productivity and economic efficiency
Solution Approach 1:
The patent divides the mounting structure into two separate components: the silicon substrate and the base film. The display driving chip is mounted on the base film rather than directly on the silicon substrate, separating the substrate function (generating display signals) from the chip mounting function. This segmentation allows the silicon substrate size to be reduced while maintaining electrical connection reliability through the base film's conductive pads and connection structures.
Solution Approach 2:
The base film acts as an intermediary component between the silicon substrate and the display driving chip. It provides the mounting surface for the chip while maintaining electrical connections to the substrate through conductive pads. This intermediary structure enables the silicon substrate to be smaller since it only needs to provide signals to the base film, not directly to chips mounted on it.
2Adaptability or versatility
If multiple semiconductor chips are mounted on the base film, then functionality is enhanced, but the base film size increases affecting miniaturization
Solution Approach 1:
The patent combines multiple semiconductor chips (display driving chip, power management chip, sensing chip) on a single base film, merging their functions into one integrated package. This allows the base film to serve as a common mounting platform for all chips, reducing the need for separate substrates for each chip and enabling miniaturization of the overall structure while maintaining enhanced functionality.
Solution Approach 2:
The base film is designed as a multi-functional component that simultaneously serves as: (1) a mounting substrate for multiple chips, (2) an electrical connection medium through its conductive pads, (3) a structural support element, and (4) a signal transmission medium between chips and the silicon substrate. This multi-functionality reduces the need for additional components and enables compact integration.
Data Source
AI summary
A display apparatus includes a silicon substrate including a first surface and a second surface opposite thereto and including an opaque material, a display panel disposed on the first surface of the silicon substrate, a base film including a third surface and a fourth surface opposite thereto, the fourth surface having a portion facing the first surface of the silicon substrate, a display driving chip mounted on the base film, a connector disposed on a portion of the third surface of the base film, and a driving printed circuit board (PCB) electrically connected with the base film, wherein the silicon substrate corresponds to the base film in a one-to-one relationship, and a length of an edge of the base film overlapping the silicon substrate is about 90% of a length of an edge of the silicon substrate parallel to the edge of the base film.