Chip Protective Film Composition for Scratch-Resistant Marking
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Solution Overview
Problem
Existing chip protective films lack scratch resistance, which is essential for protecting electronic chips and facilitating marking.
Innovation Solution
A chip protective film comprising a first protective layer and a second protective layer, where the second layer is composed of 90%-97% acrylate compounds, 0.1%-5% fluorine-containing compounds, and a second adjuvant, providing enhanced hardness and low friction coefficient through surface modification with fluorine-containing compounds, and strong adhesion to the chip substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective film is applied to the chip back surface, then the chip gains protection and marking capability, but the film lacks scratch resistance
Solution Approach 1:
The protective film uses a composite material system consisting of acrylate compounds (90-97%), fluorine-containing compounds (0.1-5%), and adjuvants. The fluorine-containing compounds modify the acrylate base material to create a coating with enhanced scratch resistance while maintaining ease of application through UV curing technology.
Solution Approach 2:
The invention changes the chemical composition parameters of the protective film by incorporating fluorine-containing compounds at specific concentrations (0.1-5% by mass). This parameter modification transforms the base acrylate material into a scratch-resistant coating while maintaining the simplicity of the manufacturing process through photopolymerization curing.
2Strength
If fluorine-containing compounds are added to enhance scratch resistance, then the film achieves high hardness and low friction coefficient, but the manufacturing process becomes more complex
Solution Approach 1:
The fluorine-containing compounds are applied locally to modify the surface properties of the acrylate coating. This local modification approach concentrates the scratch-resistant properties at the film surface where they are most needed, while the bulk material remains simple acrylate compound, thus achieving high hardness without significantly complicating the overall manufacturing process.
Solution Approach 2:
The invention replaces complex mechanical reinforcement methods with a chemical approach using fluorine-containing compounds. Instead of adding mechanical strength through layered structures or reinforcement materials, the solution uses chemical modification of the polymer surface to achieve scratch resistance, simplifying the overall device structure.
3Object-affected harmful factors
If fluorine-containing compounds are used to modify the surface, then the friction coefficient decreases and scratch resistance improves, but the material composition becomes more complex
Solution Approach 1:
The invention carefully controls the concentration parameter of fluorine-containing compounds within the range of 0.1-5% by mass. This parameter optimization achieves the desired reduction in friction coefficient and improvement in scratch resistance while minimizing the addition of complex materials. The low concentration range maintains material simplicity while delivering effective performance enhancement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The film achieves improved scratch resistance, high adhesion, and low friction coefficient, effectively protecting the chip from mechanical damage and ensuring reliable marking.
Implementation Method 1
the second layer is composed of 90%-97% acrylate compounds, 0.1%-5% fluorine-containing compounds, and a second adjuvant, providing enhanced hardness and low friction coefficient through surface modification with fluorine-containing compounds
Implementation Method 2
the second protective layer includes by mass: 90%-97% acrylate compounds
Data Source
AI summary
Disclosed are a chip protective film, a method for manufacturing the same, and a chip, which relate to the technical field of electronic chip protective films. The chip protective film includes: a first protective layer, and a second protective layer attached to at least a portion of a surface of the first protective layer. The second protective layer includes by mass: 90%-97% acrylate compounds; 0.1-5% fluorine-containing compounds; and a second adjuvant. The chip protective film features strong adhesion, low friction coefficient, high hardness, and good scratch resistance, which effectively solves the technical problem in the prior art that chip protective films are not scratch resistant.