Chip Fixing Device with Adjustable Pressing Cover
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Solution Overview
Problem
Existing fixing devices for chip tests are unable to adaptively adjust to the expansion stress of solder balls during high-temperature tests, leading to deformation and affecting test accuracy, especially when dealing with chips of varying sizes and thicknesses.
Innovation Solution
A fixing device with adjustable components, including extendable/retractable adjustors for horizontal positioning and an autonomously adjustable pressing cover for vertical positioning, allows for precise alignment and force adjustment to prevent solder ball deformation, accommodating different chip dimensions and thicknesses without the need for complex crossbeam structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fixing device is customized for each overall package dimension of chips, then the chip can be fixed accurately, but costs will be greatly increased
Solution Approach 1:
The pressing cover is designed to be movable in the vertical direction, allowing it to dynamically adjust its position and pressing force according to different chip thicknesses and solder ball expansion, replacing the need for multiple fixed fixing devices with different dimensions
Solution Approach 2:
The pressing force and position of the pressing cover can be adjusted according to different chip parameters (thickness, size), allowing a single fixing device to adapt to various chip specifications without customization, thereby reducing costs while maintaining positioning accuracy
2Stability of the object's composition
If a fixing device applies fixed pressing force to BGA chips, then the chip is securely fixed, but solder balls will be forcibly pressed to deform during high-temperature test
Solution Approach 1:
The pressing cover is designed to be movable rather than fixed, allowing it to dynamically adjust its position in response to solder ball expansion during high-temperature testing, thereby maintaining secure fixing without applying excessive force that would cause deformation
Solution Approach 2:
The movable pressing cover acts as a cushioning mechanism that can yield to the expansion force of solder balls, preventing the harmful effect of deformation while maintaining the necessary fixing stability
3Volume of moving object
If adjustors are adjusted to maximum scale position, then the fixing chamber has maximum space, but chips of different sizes cannot be accurately positioned
Solution Approach 1:
The adjustors are designed to be dynamically adjustable, allowing the fixing chamber to transition between maximum space configuration and precise positioning configuration, accommodating both large and small chips accurately
Solution Approach 2:
The adjusting mechanism is divided into multiple adjustors that can be independently adjusted, enabling precise positioning of chips of different sizes within the fixing chamber while maintaining maximum space utilization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device ensures accurate and stable contact between solder balls and test needles, preventing deformation and reducing test costs by supporting various chip sizes and thicknesses, while maintaining effective contact during high-temperature tests.
Implementation Method 1
at least one adjustable pressing cover is disposed at a lower end of the top cover, so as to autonomously adjust a pressing force applied to the to-be-tested chip by the pressing cover in the vertical direction
Data Source
AI summary
Embodiments of the present application disclose a fixing device and fixing method for chip test and a chip tester. The fixing device for chip test includes: a carrier with a fixing chamber for fixing a chip formed inside, a plurality of adjustors being disposed on sidewalls of the fixing chamber and configured to be extended or retracted to adjust a position of the chip in two orthogonal directions within a horizontal plane; and a top cover configured to cooperate with the carrier to fix the chip in a vertical direction, wherein at least one adjustable pressing cover is disposed at a bottom of the top cover, so as to autonomously adjust a pressing force applied to the chip by the pressing cover in the vertical direction. The present application is suitable for fixing chips with various overall dimensions, and can adaptively adjust a pressing force.