Chip on Flex Optical Subassembly Reducing Component Count

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Solution Overview

Problem

Traditional optical subassemblies (OSAs) with TO cans increase manufacturing costs and create electrical discontinuities due to their complex configuration, limiting port density and requiring more components.

Innovation Solution

The development of chip on flex optical subassemblies (COF OSAs) that integrate active optical components onto a flex circuit within an optical port, reducing component count and enabling higher port densities through a simpler configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional TO can configuration is used for OSA, then hermetic sealing and component protection are achieved, but device complexity and manufacturing cost increase

Engineering Contradiction:

Improvehermetic sealingVSAvoidcomponent count

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates the optical component, housing, and electrical contacts into a single integrated optical subassembly that directly mounts to the PCB, eliminating the separate TO can package. This merging reduces component count while maintaining hermetic sealing through the integrated housing design.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated OSA housing serves multiple functions simultaneously: it provides hermetic sealing for the optical component, acts as the mounting structure for electrical contacts, and functions as the structural element that directly interfaces with the PCB. This multi-functionality reduces the need for separate protective packaging.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If traditional TO can configuration is used for OSA, then component protection is achieved, but manufacturing cost increases

Engineering Contradiction:

Improvecomponent protectionVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

By combining the protective housing, optical component mounting, and electrical connection functions into a single integrated assembly, the patent reduces the total number of parts that need to be manufactured, stored, and assembled. This integration simplifies the supply chain and reduces manufacturing costs while maintaining component protection.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent segments the OSA into modular functional elements (optical component, housing, electrical contacts) that can be manufactured separately and then integrated in a single assembly step, reducing overall manufacturing complexity and cost compared to traditional multi-component TO can assemblies.

Inventive Principle:

Principle #1Segmentation

3Reliability

If traditional TO can configuration is used for OSA, then optical component containment is achieved, but port density decreases

Engineering Contradiction:

Improveoptical component containmentVSAvoidport density

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent merges the optical component containment function directly into the PCB-mounted housing structure, eliminating the need for separate TO can packaging. This integration reduces the footprint required for each optical port, thereby increasing port density on the PCB.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from the traditional three-dimensional TO can package to a planar, PCB-integrated configuration. This dimensional change allows optical components to be arranged more efficiently on the PCB surface, increasing port density while maintaining proper optical component containment and alignment.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

COF OSAs reduce manufacturing complexity and costs while enabling a smaller form factor and higher port densities, improving signal transmission and reception efficiency.

Implementation Method 1

The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

minimizing electrical discontinuities and thermal management through heat sink stiffeners

Methodology Applied

Scientific EffectHeat sinking: Heat Sink

Data Source

PatentUS9709760B2Chip on flex optical subassembly

Publication Date: 2017.07.18 II VI DELAWARE INC

AI summary

One example embodiment includes an optical subassembly (OSA). The OSA includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically coupled to the flex circuit.