Chip Floorplan Layout for Heat Dissipation and Simpler IC Wiring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current IC packaging technologies face issues such as wasted area, poor heat dissipation, and difficulty in output/input wiring due to inefficient floorplan arrangements of chips, leading to uncompetitive products and performance degradation.
Innovation Solution
A floorplan arrangement where logic chips are placed on the sides and memory chips in the central area of the IC product, with point symmetry, allowing for efficient heat dissipation, simplified wiring, and optimized substrate usage by rotating the chips' positions to avoid pin waste and simplify manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If chips are arranged without optimized floorplan, then manufacturing is simpler, but area is wasted and heat dissipation is poor
Solution Approach 1:
The patent applies asymmetry by strategically placing logic chips on the periphery and memory chips in the center, creating an asymmetric floorplan that optimizes area utilization while maintaining manufacturing feasibility through standardized chip configurations
2Area of moving object
If chips are densely arranged to reduce area, then area utilization improves, but heat dissipation deteriorates
Solution Approach 1:
The patent applies local quality by placing heat-generating logic chips on the periphery where heat can be more easily dissipated, while positioning memory chips in the cooler central region, thereby optimizing thermal management through spatial differentiation of chip types based on their thermal characteristics
3Temperature
If chips are arranged for optimal heat dissipation, then temperature control improves, but wiring complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the substrate into distinct functional zones: a central region for memory chips and peripheral regions for logic chips. This spatial segmentation naturally organizes interconnections, reducing wiring complexity while maintaining optimal thermal characteristics through the separated functional areas
4Area of moving object
If asymmetric floorplan is used to optimize layout, then area utilization improves, but pin waste increases
Solution Approach 1:
The patent applies asymmetry in the floorplan layout while maintaining symmetry in chip pairing arrangements. By placing identical chip pairs in symmetric positions (e.g., opposite sides of the substrate), the design achieves area optimization through asymmetric zoning while preserving pin compatibility and reducing waste through symmetric chip configurations
Data Source
AI summary
An integrated circuit product includes a first chip, a second chip, a third chip, a fourth chip, a fifth chip, a sixth chip, a seventh chip, and an eighth chip. The areas and constituent components of the first chip, the second chip, the third chip, and the fourth chip are substantially the same. The areas and constituent components of the fifth chip, the sixth chip, the seventh chip, and the eighth chip are substantially the same. The first chip, the second chip, the third chip, and the fourth chip are respectively arranged on the four sides of the integrated circuit product. The fifth chip, the sixth chip, the seventh chip, and the eighth chip are arranged in a central area of the integrated circuit product.