Apertured Chip Protection Frame for Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to protect semiconductor chips while simultaneously improving their heat dissipation characteristics, as they trend towards miniaturization and weight reduction, requiring effective heat management solutions.
Innovation Solution
A chip protection device with a protection frame surrounding the semiconductor chip, featuring side walls, upper walls, and lower walls with apertures that allow fluid flow, facilitating heat transfer from the chip to the fluid within the enclosed space, enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protection frame surrounds the semiconductor chip, then the chip is protected, but heat dissipation is hindered
Solution Approach 1:
The protection frame incorporates apertures (openings) in its structure, allowing it to function as a porous material that permits fluid penetration. This enables the frame to protect the chip while simultaneously allowing heat dissipation through fluid flow, resolving the contradiction between protection and thermal management.
Solution Approach 2:
The invention utilizes fluid flow (pneumatics or hydraulics) through the apertures in the protection frame to enhance heat dissipation. The fluid carries heat away from the chip surface, allowing the frame to provide both mechanical protection and active thermal management.
2Temperature
If the protection frame is designed with walls spaced apart from the chip, then heat transfer surface area increases, but device complexity increases
Solution Approach 1:
The protection frame is segmented into multiple walls with apertures rather than a solid continuous structure. This segmentation increases the surface area available for heat transfer while maintaining a relatively simple overall frame geometry, balancing thermal performance with structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively protects the semiconductor chip and improves heat dissipation by allowing fluid flow through the apertures, increasing the surface area for heat transfer and reducing temperature rise, thus enhancing the chip's operational reliability.
Implementation Method 1
Heat from at least some of the side surfaces of the semiconductor chip is transferred to the fluid in the inner space
Data Source
AI summary
A chip protection device includes a protection frame extending around side surfaces of a semiconductor chip mounted on a substrate. The protection frame includes a plurality of side walls, each wall facing and spaced apart from a respective side surface of the semiconductor chip, and a plurality of upper walls, each upper wall extending inward from an upper portion of a respective side wall toward the semiconductor chip. A plurality of apertures are formed through the side walls and through which a fluid enters and exits. The protection frame defines an inner space in which the fluid can flow via the plurality of apertures. Heat from the side surfaces of the semiconductor chip is transferred to the fluid in the inner space.