Chip Fuse Electrode Protrusions for Reliable Plated Connections
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Solution Overview
Problem
Existing chip-type fuses experience insufficient electrical connections between plating layers and electrodes due to exposure and contact limitations.
Innovation Solution
A chip-type fuse design featuring internal electrodes with protrusions covered by conductive layers, where the protrusions protrude from the casing's concave surfaces, ensuring reliable electrical connections without interfering with soldering processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrodes are exposed and just in contact with the plating layers, then the structure is simple, but sufficient electrical connection is not obtained
Solution Approach 1:
The electrode structure transitions from a 2D planar contact to a 3D protruding structure. The internal electrodes extend outward from the fusible body as protrusions, creating multiple contact points and increasing the contact area with the conductive layers in three-dimensional space, thereby improving electrical connection reliability.
Solution Approach 2:
The internal electrodes are pre-formed with protrusions that extend beyond the fusible body before assembly. This preliminary formation of contact structures ensures that when the conductive layers are applied, sufficient electrical connection is already established, eliminating the need for additional connection mechanisms.
2Reliability
If the protrusions are formed to extend from the electrodes, then electrical connection is improved, but interference with soldering may occur
Solution Approach 1:
The protrusions are strategically positioned and dimensioned to provide adequate electrical contact area while maintaining a profile that does not extend beyond the casing boundaries. This localized optimization ensures sufficient electrical connection at the contact points while preventing interference with soldering operations at the casing ends.
Solution Approach 2:
The conductive layers serve as an intermediary between the protruding internal electrodes and the external connection points. These layers are formed to cover the protrusions completely, providing a smooth transition surface that maintains electrical continuity while preventing the protrusions from interfering with soldering processes.
3Reliability
If the conductive layers cover the protrusions, then electrical connection is enhanced, but manufacturing complexity increases
Solution Approach 1:
The conductive layers are designed to perform multiple functions simultaneously: they cover the protruding internal electrodes to ensure electrical connection, provide a smooth surface for soldering operations, and extend to form external connection points. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves robust and reliable electrical connections between internal electrodes and conductive layers, enhancing the fuse's performance in surface mounting applications while preventing interference during soldering.
Implementation Method 1
The conductive layers can be formed by plating the exposed portions
Data Source
AI summary
A chip-type fuse includes a plated-shape fusible body (26). The fusible body (26) has internal electrodes (28 and 30) facing toward the center of the straight line from both ends of the straight line, respectively and has a fusible portion (32) formed between the internal electrodes (28 and 30) and integrated with them. The fusible body is housed into a casing (2). Protrusions (38 and 40) protrude from the parts of the both ends of the internal electrodes (28 and 30). The protrusions (38 and 40) are covered with plating layers (50 and 52).