Chip on Glass Package Assembly for Touch Display Cost Reduction
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Solution Overview
Problem
The production cost of touch and display technology is high due to complex and expensive electrical testing of flexible circuit boards, which are used to connect touch and display panels to driving devices.
Innovation Solution
A chip on glass package assembly is introduced, where passive devices like flash memory chips are integrated onto the glass substrate, simplifying the flexible printed circuit board layout and eliminating the need for surface mount processes, with connecting lines and conductive bumps facilitating chip integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible circuit board with mounted electronic devices is used to connect the touch and display panel to the driving device, then electrical connection is achieved, but production cost increases due to complex layout and expensive electrical testing
Solution Approach 1:
The patent merges the functions of the flexible circuit board and the chip carrier into a single integrated structure. The glass substrate serves both as the structural support for mounting chips and as the circuit carrier, eliminating the need for a separate FPC board with surface-mounted electronic devices. This integration resolves the contradiction by maintaining electrical connection functionality while removing the complexity of FPC layout and testing.
2Reliability
If electronic devices are mounted on the flexible circuit board, then electrical connection is achieved, but production cost increases due to expensive electrical testing
Solution Approach 1:
The patent extracts the electronic devices from the flexible circuit board and integrates them directly onto the glass substrate in a chip-on-glass configuration. By taking out the FPC board and its mounted components, the invention eliminates the need for expensive electrical testing of FPC-mounted devices while maintaining all necessary electrical connection functions through direct chip-to-substrate bonding.
3Device complexity
If chips are integrated directly onto the glass substrate, then FPC board design is simplified, but chip layout precision requirements increase
Solution Approach 1:
The patent incorporates preliminary alignment features directly into the glass substrate design, including alignment marks and precisely positioned connection regions. These pre-designed alignment structures enable accurate chip placement during the chip-on-glass bonding process, resolving the contradiction by providing built-in precision guidance that simplifies FPC design while ensuring accurate chip positioning without requiring post-placement adjustments.
Data Source
AI summary
A chip on glass package assembly includes a glass substrate, a first type chip, a second type chip and a plurality of connecting lines. The glass substrate includes an active area and a peripheral area connected to the active area. The first type chip is mounted on the peripheral area and including a processor. The second type chip is mounted on the peripheral area and located on a side of the first type chip, wherein the second type chip is different from the first type chip. The connecting lines are disposed on the peripheral area and connecting the first type chip and the second type chip.