On-Chip Power-Glitch Detection with Internal Self-Testing

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Solution Overview

Problem

Existing systems-on-chip (SoC) designs lack effective methods to detect and counter power-glitch attacks, which are sophisticated hacking techniques that compromise chip security.

Innovation Solution

A chip design incorporating a processor, glitch detector, and self-testing circuit with a glitch generator and controller, enabling internal power-glitch detection and self-testing without external test pads, using a phase-locked loop for sharp glitch signals and multiplexers for mode switching.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If power-glitch detection is implemented on chip, then chip security against power-glitch attacks is improved, but device complexity increases due to additional glitch detector and self-testing circuit components

Engineering Contradiction:
Improvechip securityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The glitch detector and self-testing circuit are integrated within the chip architecture, merging security functions with existing processor and power management structures. This consolidation improves chip security while minimizing the increase in device complexity by sharing resources and avoiding separate external testing infrastructure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The self-testing circuit enables the glitch detector to automatically test and verify its own functionality through internal glitch signal generation and detection. This self-service capability ensures reliable power-glitch detection without requiring external testing equipment, thereby improving security while keeping the device complexity manageable through autonomous operation.

Inventive Principle:
Principle #25Self-service

2Reliability

If self-testing circuit is added for glitch verification, then detection reliability is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvedetection reliabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The self-testing circuit is divided into functional modules including glitch signal generation, glitch injection, and verification components. This segmentation allows for modular manufacturing and testing, improving detection reliability while facilitating easier fabrication through standardized modular processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The self-testing circuit is designed to work with the existing processor and power management infrastructure, serving multiple functions including glitch detection, verification, and security monitoring. This multi-functionality improves detection reliability without significantly increasing manufacturing complexity by leveraging existing chip structures.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Device complexity

If internal glitch signal generation is implemented, then external testing infrastructure is reduced, but use of energy increases due to additional active components

Engineering Contradiction:
Improveexternal testing infrastructureVSAvoiduse of energy
Core Design Contradiction:
Device complexityVSUse of energy by moving object

Solution Approach 1:

The glitch signal generation capability is extracted and integrated directly into the chip's self-testing circuit, eliminating the need for external testing infrastructure. This internalization reduces external complexity while the energy consumption is managed through efficient circuit design and controlled activation only during testing phases.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The self-testing circuit operates periodically or on-demand rather than continuously, generating glitch signals only when verification is needed. This periodic operation reduces energy consumption from the additional active components while maintaining the capability for internal glitch signal generation that eliminates external testing infrastructure.

Inventive Principle:
Principle #19Periodic action

Data Source

PatentUS20260029465A1Chip with power-glitch detection and power-glitch self-testing
Publication Date: 2026.01.29 MEDIATEK INC
  • US20260029465A1 patent drawing
  • US20260029465A1 patent drawing
  • US20260029465A1 patent drawing

AI summary

Power-glitch detection and power-glitch self-testing within a chip is shown. In a chip, a processor has a power terminal, a glitch detector, and a self-testing circuit. The power terminal is configured to receive power. The glitch detector is coupled to the power terminal of the processor for power-glitch detection. The self-testing circuit has a glitch generator and a glitch controller. The glitch controller controls the glitch generator to generate a self-testing glitch signal within the chip to test the glitch detector. The self-testing glitch signal is further fed back to the glitch controller for verification, and the glitch controller presents an error of the self-testing glitch signal by an error flag.