Automated Chip Grinding With Vacuum Debris Control
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Solution Overview
Problem
Traditional chip grinding devices suffer from low efficiency and precision due to manual operation, leading to prolonged grinding times and reduced yield of finished products.
Innovation Solution
A chip grinding device with a fixture, grinding assembly, moving assembly, vacuum assembly, and controller that automates the grinding process, ensuring precise positioning and debris collection, while allowing power adjustment based on grinding conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual operation is used for grinding, then the device structure is simple, but the grinding efficiency and precision are low
Solution Approach 1:
The patent replaces the manual mechanical grinding system with an automated grinding assembly that includes a grinding head, motor, and control system. The controller automatically controls the grinding head's movement and positioning, substituting human manual operation with an automated mechanical-electrical control system, thereby improving grinding efficiency and precision while maintaining reasonable device complexity through modular design.
2Loss of time
If manual grinding is used, then the device is simple to operate, but the grinding time is long
Solution Approach 1:
The patent implements preliminary action by pre-programming the grinding path, speed, and depth parameters in the controller. Before actual grinding begins, all motion trajectories and processing parameters are predetermined, allowing the grinding head to automatically execute the optimized path without manual intervention during the grinding process, significantly reducing grinding time while maintaining ease of operation through automated execution.
Solution Approach 2:
The patent ensures continuity of useful action by designing an automated grinding system that continuously moves the grinding head along the programmed path without interruptions. The motor-driven grinding head maintains constant motion and contact with the workpiece throughout the grinding process, eliminating the start-stop nature of manual grinding and thereby reducing total grinding time while the controller maintains operational simplicity.
3Manufacturing precision
If automated grinding is implemented, then grinding precision is improved, but device complexity increases
Solution Approach 1:
The patent replaces manual mechanical positioning with an automated control system that precisely controls the grinding head's movement in three dimensions. The controller receives positioning signals and automatically adjusts the grinding head's X, Y, and Z axis movements, achieving high grinding precision through electronic control rather than manual mechanical adjustment, thereby improving accuracy while managing device complexity through integrated control architecture.
Solution Approach 2:
The patent implements feedback mechanisms where the controller continuously monitors the grinding head's position and adjusts motion parameters in real-time to maintain precision. The system uses position feedback from encoders or sensors to correct deviations from the programmed path, ensuring high grinding accuracy while the automated feedback loop manages the complexity of precise positioning through intelligent control algorithms rather than overly complex mechanical structures.
4Object-affected harmful factors
If vacuum assembly is added for debris collection, then the working environment is improved, but device complexity increases
Solution Approach 1:
The patent extracts the harmful debris and dust from the working environment by incorporating a vacuum assembly that actively removes particles generated during grinding. The vacuum system is positioned to collect debris at its source near the grinding head, separating the harmful particles from the work area and directing them to a collection container, thereby improving the working environment while managing device complexity through targeted extraction rather than comprehensive environmental control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves improved grinding efficiency and accuracy, maintains a clean environment, and reduces power consumption by automating operations and effectively collecting debris and dust.
Implementation Method 1
The vacuum assembly is arranged on one side of the clamp for collecting the debris and dust generated when the chip is grinding
Data Source
AI summary
The present application introduces a chip grinding device and a chip grinding method. The chip grinding device includes: a fixture for holding the chip; a grinding assembly set above the fixture for grinding the chip; a moving assembly connected to the grinding assembly for adjusting the position of the grinding assembly; a vacuum assembly set on one side of the fixture for collecting debris and dust generated during chip grinding, wherein the vacuum assembly is equipped with a speed control button for adjusting the collection power; and a controller electrically connected to at least the grinding assembly and the moving assembly for controlling the operation of the grinding assembly and the moving assembly. Therefore, the application avoids the problems of low efficiency and low precision caused by manual grinding, maintains the cleanliness of the surrounding environment, and avoids problems such as short circuits of chips caused by debris and dust.