Laminated Chip Groove Soldering Stability
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Solution Overview
Problem
The surface mounting technique (SMT) often results in poor soldering phenomena due to non-uniform solder bonding on printed circuit boards, which can go undetected in automatic optical inspections and lead to defects in completed products.
Innovation Solution
A laminated-type chip component with soldering grooves of specific shapes and sizes on its external electrode terminals, which increase the contact area with solder, ensuring stable bonding by forming hexahedral, triangular, or uneven surfaces to enhance solder wettability and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional flat solder joint surface is used, then the manufacturing process is simple, but the solder bonding is non-uniform leading to poor soldering phenomena
Solution Approach 1:
The solder joint part is designed with localized grooves (first groove, second groove, third groove) that create varying surface depths and geometries. These grooves concentrate solder in specific regions, ensuring uniform solder distribution across the joint area while maintaining overall structural simplicity.
Solution Approach 2:
The invention transitions from a conventional flat two-dimensional solder joint surface to a three-dimensional structured surface with grooves of varying depths. This dimensional change creates multiple levels (first level, second level, third level) that enhance solder wettability and bonding uniformity.
2Reliability
If the solder joint part is enlarged to improve bonding area, then solder bonding improves, but the chip component size increases
Solution Approach 1:
The solder joint part is segmented into multiple regions defined by grooves (first groove, second groove, third groove) that divide the bonding area into distinct zones. This segmentation increases the effective bonding surface area within the same overall footprint, improving solder bonding without increasing chip component dimensions.
Solution Approach 2:
The groove structures are nested within the existing solder joint part boundaries, creating additional bonding surfaces through hierarchical level structures (first level, second level, third level) rather than expanding the overall component size.
3Productivity
If automatic optical inspection is used to detect soldering defects, then inspection speed is high, but poor soldering phenomena are not precisely checked
Solution Approach 1:
The groove structures create distinct surface geometries and light reflection patterns that make soldering defects more visually distinguishable. The varying depths and angles of the grooves produce observable differences in light reflection and shadow patterns, enabling automatic optical inspection systems to more easily detect poor soldering phenomena while maintaining high inspection speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased contact area through these grooves leads to more stable solder bonding, reducing the likelihood of poor soldering phenomena and enhancing the reliability of the chip component's attachment to the PCB.
Implementation Method 1
one or more soldering grooves (1222) having predetermined sizes are formed in a portion of the solder joint (1222)... the increased contact area through these grooves leads to more stable solder bonding
Data Source
AI summary
The present disclosure relates to a laminated-type chip component, and more particularly, to a laminated-type chip component which can be more stably bonded by forming a groove filled with solder in a region in which an external electrode terminal of the laminated-type chip is soldered and thereby increasing the area of soldering.