Semiconductor Chip Groove Wire Insertion by Melting Bonding Pads
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Solution Overview
Problem
The existing methods for inserting a wire into a semiconductor chip groove require significant effort, which can lead to wire weakening or breakage, and are sensitive to precise dimension adjustments, making them inefficient in high-production contexts.
Innovation Solution
A method involving a bonding material pad with a low melting point in the groove, where the wire is positioned against the pad and heated above the melting point to melt and secure the wire in place, reducing the need for forceful insertion and allowing for easier assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If forceful insertion is used to embed the wire in the groove, then the wire can be mechanically joined to the chip, but the wire may be weakened or broken during or after insertion
Solution Approach 1:
The patent changes the physical state of the bonding material from solid to liquid by heating it above its melting point, allowing the wire to be inserted without force. The bonding material then solidifies to secure the wire, eliminating the need for forceful insertion that could damage the wire.
Solution Approach 2:
The patent utilizes the phase transition of the bonding material from solid to liquid state through heating. The bonding material is heated above its melting point to become liquid, enabling easy wire insertion, then cools and solidifies to mechanically secure the wire without requiring forceful embedding.
2Manufacturing precision
If precise dimension adjustments are made to the groove and wire, then a robust assembly is achieved, but the process becomes sensitive to adjustment errors and reduces productivity
Solution Approach 1:
The patent changes the state of the bonding material to liquid through heating, which allows the wire to be inserted into the groove without requiring precise dimensional matching. The liquid bonding material flows to accommodate slight variations in wire and groove dimensions, then solidifies to create a robust connection, thereby reducing sensitivity to dimensional adjustments and improving productivity.
3Strength
If adhesive material or soldering is used to reinforce the assembly, then the connection is strengthened, but the process complexity and time increase
Solution Approach 1:
The patent merges the bonding and securing functions into a single integrated process. The bonding material serves both as the insertion medium (when liquid) and the mechanical securing agent (when solidified), eliminating the need for separate adhesive application or soldering steps, thus reducing process complexity while maintaining connection strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the efficient and robust assembly of wires into semiconductor chip grooves without excessive force, enhancing production efficiency and reducing wire damage, while ensuring a strong mechanical connection.
Implementation Method 1
exposing a zone containing at least one portion of the pad to a processing temperature higher than the melting point of the bonding material and for a sufficient time to make the pad at least partially melt
Data Source
AI summary
A method for inserting a wire into a longitudinal groove of a semiconductor chip for the assembly thereof, the groove containing a pad made of a bonding material having a set melting point, comprises: in a positioning step, placing a longitudinal section of the wire along the groove, in forced abutment against the pad; and, in an insertion step, exposing a zone containing at least one portion of the pad to a processing temperature higher than the melting point of the bonding material and for a sufficient time to make the pad at least partially melt, and causing the wire to be inserted into the groove. The present disclosure also relates to a piece of equipment allowing the insertion method to be implemented.