Semiconductor Chip Guard with Multi-Layer Barrier Patterns
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Solution Overview
Problem
Existing semiconductor chip guard structures fail to effectively prevent moisture and crack propagation from the chip sealing region into the device region, leading to potential damage and reduced structural stability.
Innovation Solution
A semiconductor device with a chip guard structure comprising multiple metal layers, interlayer insulating layers, and barrier patterns extending towards the substrate, which are spaced apart to block moisture and crack propagation, and a barrier trench with a metal barrier layer along its sidewall to enhance protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional guard ring structure is used to protect integrated circuits, then moisture protection is provided, but the structure fails to effectively prevent crack propagation and has limited structural stability
Solution Approach 1:
The chip guard is divided into multiple metal layers (first metal layer, second metal layer, third metal layer) stacked vertically, with each layer serving as a separate barrier. Barrier patterns are segmented and distributed across different layers, creating a multi-level defense system that effectively blocks both moisture and crack propagation while maintaining structural integrity
Solution Approach 2:
The protection structure transitions from a conventional planar guard ring to a three-dimensional multilayer configuration. The barrier patterns extend in multiple directions and are positioned at different vertical levels, creating a spatial network that provides comprehensive protection against moisture ingress and crack propagation from the chip sealing region
2Reliability
If barrier patterns are positioned close to metal layers for compactness, then space is saved, but moisture and crack protection effectiveness is reduced
Solution Approach 1:
The barrier patterns are arranged in a three-dimensional configuration across multiple metal layers. By distributing barrier patterns vertically across different layers rather than horizontally in a single plane, the structure achieves effective protection with optimized horizontal spacing, allowing compact chip layout while maintaining protection effectiveness
Solution Approach 2:
Multiple barrier patterns are nested across different metal layers, with each layer's barrier pattern positioned to complement and reinforce the others. This nested arrangement creates overlapping protection zones that enhance moisture and crack blocking capability while minimizing the horizontal footprint of the chip guard
Data Source
AI summary
A semiconductor chip includes an integrated circuit disposed in a device region, and a chip guard disposed in a chip sealing region that is an outer portion of the device region. The chip guard includes a first metal layer disposed over a substrate, an interlayer insulating layer disposed on the first metal layer, a second metal layer disposed on the interlayer insulating layer, and a barrier pattern extending in a direction towards the substrate from the second metal layer through the interlayer insulating layer. The barrier pattern is disposed to be spaced apart from the first metal layer.