Chip Heat Dissipation Structure for LCD Backlight Modules
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Solution Overview
Problem
Conventional liquid crystal display devices face challenges in effectively dissipating heat generated by chips, particularly in large-screen and high-brightness displays, and this issue is exacerbated in vehicle displays where increased power consumption leads to significant heat buildup near the chip.
Innovation Solution
A chip heat dissipation structure made of thermal conductive material, with a chip contact end and a backplate contact end, is designed to conduct heat from the chip to the backplate of the backlight module, utilizing materials like graphite or copper foil with high thermal conductivity (100 W/m·K) and a thickness of 0.03-0.2 mm to efficiently manage heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation methods targeting the light strip are used, then the light strip heat dissipation is improved, but the chip heat dissipation remains insufficient
Solution Approach 1:
The heat dissipation structure is segmented into multiple functional layers: a first heat dissipation layer directly contacting the chip, a second heat dissipation layer contacting the backplate, and an insulating layer. This segmentation allows targeted heat dissipation from the chip through the first layer to the backplate via the second layer, while the insulating layer prevents heat from reaching the screen, thereby improving chip heat dissipation without requiring complete structural redesign.
Solution Approach 2:
The patent introduces an insulating layer as an intermediary component between the heat dissipation layers and the screen. This insulating layer acts as a thermal barrier that blocks heat transfer to the screen while allowing the heat dissipation structure to function. This mediator enables the system to dissipate chip heat effectively without causing screen overheating, resolving the contradiction between heat dissipation effectiveness and screen temperature control.
2Temperature
If high thermal conductivity materials are used to improve heat dissipation, then heat conduction efficiency is improved, but device thickness increases
Solution Approach 1:
The patent employs thin film structures for the heat dissipation layers, with the first heat dissipation layer having a thickness of 0.01-0.1 mm and the second heat dissipation layer having a thickness of 0.01-0.05 mm. These thin films are made of materials with high thermal conductivity (such as aluminum or copper), allowing efficient heat conduction from the chip to the backplate while maintaining minimal thickness. This approach enables effective heat dissipation without significantly increasing the overall device thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively lowers the temperature of the chip by conducting heat to the backplate, addressing the issue of heat buildup on the surface of liquid crystal display devices, especially in vehicle displays, by utilizing a thermal conductive material with high thermal conductivity.
Implementation Method 1
the chip heat dissipation structure is made of thermal conductive material... a first surface serving as a chip contact end... a second surface serving as a backplate contact end... effectively lowers the temperature of the chip by conducting heat to the backplate
Data Source
AI summary
The present invention discloses a chip heat dissipation structure and a liquid crystal display device, and the chip heat dissipation structure includes: a chip contact end and a backplate contact end. The chip heat dissipation structure is made of thermal conductive material. The backplate is a backplate on a bottom of a backlight module in the liquid crystal display device. The present invention by conducting heat generated by the chip to the backplate lowers the increased temperature of the chip to solve the issue the heated surface of the liquid crystal display device.