Chip Package Heat Exchanger With Parallel Flow Paths
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Solution Overview
Problem
Conventional thermal management systems for electronic devices with chip package assemblies face challenges in efficiently dissipating heat, particularly in applications where air cooling is insufficient, leading to diminished service life and potential device failure.
Innovation Solution
A heat exchanger with multiple flow ports and surface area increasing structures, including fins, channels, and porous metal materials, is integrated into the thermal management system to enhance heat transfer efficiency by allowing fluid to flow through multiple paths and increase the surface area for heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-path liquid cooling system is used, then the device complexity is reduced, but the heat transfer efficiency deteriorates
Solution Approach 1:
The cooling system is segmented into multiple flow paths with separate inlet and outlet ports for each path. This allows the coolant to flow through multiple parallel channels, increasing the overall heat transfer surface area and efficiency without requiring a single complex path, thus resolving the contradiction between system complexity and heat transfer efficiency.
2Temperature
If the coolant flow path is extended, then the heat transfer efficiency is improved, but the pressure drop increases
Solution Approach 1:
The extended flow path is segmented into multiple parallel channels with individual inlet and outlet ports. This segmentation allows the total flow path length to be distributed across multiple shorter parallel paths, maintaining the benefits of extended heat transfer surface area while reducing the pressure drop that would occur in a single long path.
Solution Approach 2:
The cooling system transitions from a single-dimensional linear flow path to a multi-dimensional parallel flow architecture. By adding the dimension of parallelism with multiple inlet and outlet ports, the system achieves extended effective flow path length while maintaining lower pressure drops through distributed flow distribution.
3Temperature
If multiple inlet and outlet ports are added, then the heat transfer efficiency is improved, but the device complexity increases
Solution Approach 1:
Each inlet and outlet port is designed to serve multiple functions: providing flow distribution, enabling thermal management of specific regions, and facilitating modular integration. This multi-functionality reduces the need for additional specialized components, thereby limiting the increase in device complexity despite adding multiple ports.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves thermal management by increasing heat transfer efficiency, reducing stress on solder connections, and enhancing the reliability and effectiveness of the cooling system.
Implementation Method 1
a thermal interface material disposed between the lower side of the heat exchanger and the top surface of the IC die
Implementation Method 2
the liquid coolant moves in single path from the inlet to the outlet... the inlet region has a highest temperature differential to drive heat transfer
Data Source
AI summary
A heat exchanger for a chip package is provided. The heat exchanger includes a body having an upper side, a lower side, and an internal cavity disposed in the body between the upper side and the lower side. A first outlet port and a second outlet port are formed in the body and are in fluid communication with the internal cavity. An inlet port is formed through the upper side of the body between the first and second outlet ports to supply fluid into the internal cavity.