Chip Heat Sink Gap Control for Thermal Contact and Protection
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Solution Overview
Problem
High-power consumption chips face challenges in heat dissipation and protection, with existing methods either inadequately dissipating heat or risking chip damage due to excessive pressure from heat sinks.
Innovation Solution
An electronic apparatus comprising a circuit board, a chip, a heat sink, and a limiting member, where a heat dissipation medium is placed between the heat sink and the chip, and the limiting member adjusts the gap and pressure to enhance heat transfer efficiency while preventing chip damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat sink is removed to expose the chip for better heat dissipation, then heat dissipation efficiency is improved, but chip protection is weakened and damage probability increases
Solution Approach 1:
The patent divides the heat dissipation structure into multiple components: heat dissipation fins, heat dissipation plates, and heat dissipation channels. This segmentation allows heat to be dissipated through multiple paths while maintaining chip protection, resolving the contradiction between heat dissipation efficiency and chip protection.
Solution Approach 2:
The patent introduces heat dissipation medium (thermal interface material) as an intermediary between the chip and heat sink. This intermediary enables effective thermal contact while providing cushioning and protection for the chip, simultaneously achieving good heat dissipation and chip protection.
2Temperature
If the heat sink is pressed tightly against the chip to improve heat transfer, then heat dissipation efficiency is improved, but excessive pressure may crush the chip
Solution Approach 1:
The patent employs elastic elements and cushioning structures between the heat sink and chip to provide beforehand cushioning. These elements absorb excess pressure and prevent direct transmission of crushing forces to the chip, enabling tight thermal contact without compromising chip integrity.
Solution Approach 2:
The patent uses compliant materials and elastic structures that can dynamically adjust their mechanical properties. These structures change their stiffness and pressure distribution based on assembly conditions, maintaining optimal thermal contact pressure while preventing excessive force that could damage the chip.
3Reliability
If a thick layer of heat dissipation medium is used to ensure chip protection, then chip protection is improved, but heat transfer efficiency decreases
Solution Approach 1:
The patent employs thin-film heat dissipation medium with high thermal conductivity. These thin films provide adequate cushioning and protection for the chip while minimizing thermal resistance, achieving both chip protection and efficient heat transfer without requiring thick material layers.
Solution Approach 2:
The patent uses composite heat dissipation structures combining materials with different properties - soft compliant layers for protection and protection, paired with high-conductivity thermal interface materials for heat transfer. This composite approach enables simultaneous achievement of chip protection and efficient thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency and reduces the risk of chip damage by minimizing the heat dissipation medium thickness and controlling pressure, ensuring effective heat transfer and protection.
Implementation Method 1
A heat dissipation medium is provided between the second heat dissipation surface and the first heat dissipation surface of the chip... heat transfer efficiency between the first heat dissipation surface and the second heat dissipation surface may be improved
Data Source
AI summary
An electronic apparatus, including a circuit board, a chip, a heat sink, and a limiting member. The chip is fastened to the circuit board. A surface that is of the chip and that is away from the circuit board forms a first heat dissipation surface. A surface that is of the heat sink and that faces the circuit board forms a second heat dissipation surface. A heat dissipation medium is provided between the second heat dissipation surface and the first heat dissipation surface of the chip. The limiting member is disposed on one of the heat sink and the circuit board, and forms a gap with the other. The heat sink is not carried on the limiting member and has a specific gap with the limiting member, and the second heat dissipation surface presses against the first heat dissipation surface when acting on the first heat dissipation surface.