Chip Active-Surface Heat Spreading to Reduce Thermal Resistance
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Solution Overview
Problem
The existing heat dissipation technologies for chips face challenges due to low thermal conductivity and high thermal resistance, particularly at locations with uneven temperatures, leading to performance issues from excessive local heating.
Innovation Solution
The implementation of a thermal conductive sheet with high thermal conductivity, connected to the chip's active surface using a bonding layer, to facilitate rapid heat transfer and even temperature distribution, combined with conductive pillars and barrier layers to enhance connection strength and prevent material diffusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a thermal interface material (TIM) is used to connect the passive surface of the die to the heat spreader, then the heat transfer path is established, but thermal resistance is relatively large and heat dissipation speed is relatively low
Solution Approach 1:
The patent extracts and removes the thermal interface material (TIM) from the heat transfer path. By directly bonding the active surface of the die to the heat spreader, the TIM layer is eliminated, thereby removing the source of thermal contact resistance and improving heat dissipation speed.
Solution Approach 2:
The patent changes the connection dimension from connecting the passive surface to the heat spreader (through TIM) to directly connecting the active surface to the heat spreader. This dimensional reconfiguration eliminates the need for TIM and reduces thermal resistance in the heat transfer path.
2Reliability
If the passive surface of the die is connected to the heat spreader by using TIM, then connection is achieved, but thermal contact resistance is relatively large affecting heat dissipation
Solution Approach 1:
The patent extracts and removes the thermal interface material (TIM) from the connection between the die and heat spreader. By directly bonding the active surface of the die to the heat spreader, the TIM layer is eliminated, thereby removing the source of thermal contact resistance and improving heat dissipation efficiency.
3Temperature
If temperatures on the active surface are uneven, then heat generation occurs, but it is difficult to quickly dissipate heat at locations with relatively high temperature
Solution Approach 1:
The patent removes the thermal interface material that creates thermal resistance. By directly bonding the active surface to the heat spreader, heat can be quickly conducted away from high-temperature locations, improving both temperature uniformity and heat dissipation speed.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the heat transfer path by eliminating the TIM layer and creating a direct bond with high thermal conductivity, enabling faster heat dissipation from high-temperature regions and improving temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces thermal resistance, enabling efficient heat dissipation and uniform temperature distribution across the chip, thereby maintaining performance and reducing the impact of high local temperatures.
Implementation Method 1
heat at a location with a relatively high temperature on the active surface can be quickly conducted to a location with a relatively low temperature by using the connected thermal conductive sheet
Implementation Method 2
The active surface of the die is connected to the thermal conductive sheet by using a first bonding layer
Implementation Method 3
a barrier layer needs to be disposed between the conductive pillars and the thermal conductive sheet, to prevent the material of the conductive pillars from diffusing into the thermal conductive sheet
Data Source
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AI summary
Embodiments of this application provide a chip and a manufacturing method thereof, and an electronic device, and belong to the field of chip heat dissipation technologies. The chip includes a die and a thermal conductive sheet. An active surface of the die is connected to the thermal conductive sheet by using a first bonding layer. Heat generated at a part with a relatively high temperature on the active surface of the die can be quickly conducted and dispersed by using the thermal conductive sheet, so that temperatures on the active surface are evenly distributed to avoid an excessively high local temperature of the chip, thereby preventing running of the chip from being affected.