Chip Module Heat Dissipation Structure With Thermal Conductive Underfill
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Solution Overview
Problem
Existing heat dissipation methods in electronic devices, such as mobile phones, are inadequate for managing the increasing heat generated by chips like SOC, DDR, and PMU, leading to performance suppression and user experience issues.
Innovation Solution
Implementing a heat dissipation structure with thermal conductive underfill between chip modules and the main board, along with multiple heat conduction paths to both the display screen and rear cover sides, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal conductive gel or pad is used to export heat from chip to screen side or rear housing side, then heat dissipation is implemented along single path, but heat dissipation capability is insufficient for continuously increased chip heat generation
Solution Approach 1:
The heat dissipation path is segmented into multiple independent pathways: one path through the screen side (chip → thermal conductive gel → shielding frame → vapor chamber → screen) and another path through the rear housing side (chip → thermal conductive pad → shielding frame → vapor chamber → rear cover). This segmentation allows heat to be distributed and dissipated through multiple routes simultaneously, increasing overall heat dissipation capability without requiring a single complex system.
Solution Approach 2:
The patent transitions from single-direction heat dissipation to multi-directional heat dissipation by adding vertical heat conduction paths through the main board. The thermal conductive underfill material enables heat to conduct vertically through the main board in addition to the horizontal paths through screen and rear housing sides, creating three-dimensional heat dissipation architecture that significantly enhances heat dissipation capability.
2Productivity
If single heat dissipation path is used, then device structure is simple, but chip performance is suppressed due to insufficient heat dissipation
Solution Approach 1:
The main board is given multiple functions: it serves as both the mounting platform for chips and electronic components and as an active heat dissipation pathway. By incorporating thermal conductive underfill material, the main board becomes a dual-function component that supports both electrical connectivity and thermal management, enabling heat to be dissipated through the main board to the rear housing side while maintaining its structural and electrical functions.
Solution Approach 2:
The patent employs composite thermal management materials including thermal conductive gel, thermal conductive pad, and thermal conductive underfill material with thermal conductivity ≥0.5 W/m·K. These composite material solutions combine different thermal conductivity characteristics to optimize heat dissipation across multiple paths, enabling effective heat management while maintaining reasonable device complexity.
3Temperature
If thermal conductive underfill with high thermal conductivity is used, then heat can be conducted to main board for dissipation, but manufacturing precision requirement increases
Solution Approach 1:
The patent specifies a minimum thermal conductivity parameter (≥0.5 W/m·K) for the underfill material, transforming the selection criterion from general thermal conductivity to a quantifiable threshold. This parameter change enables manufacturers to select from multiple materials meeting the threshold, providing flexibility in manufacturing while ensuring adequate heat conduction performance, thereby balancing heat dissipation requirements with manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved heat dissipation structure allows heat to be conducted in multiple directions, reducing chip heat generation and enhancing performance release, thereby improving user experience.
Implementation Method 1
thermal conductivity of the thermal conductive underfill is greater than or equal to 0.5 w/m·K... heat generated by the first chip module... can be conducted to the main board through the thermal conductive underfill
Implementation Method 2
a heat conduction layer is formed between the first chip module and the first shielding case, and between the first shielding case and the display screen... heat... can be conducted to a display screen side through a shielding case for heat dissipation
Data Source
AI summary
This application provides an electronic device, and the electronic device includes: a display screen; a rear cover; a middle frame; a main board, mounted on the middle frame, and located between the display screen and the rear cover; a first chip module, welded on a first surface of the main board by using a solder ball; and a first shielding case, located on the first surface of the main board, and shielding the first chip module, where a heat conduction layer is formed between the first chip module and the first shielding case, and between the first shielding case and the display screen; and a thermal conductive underfill that wraps the solder ball is filled between the first chip module and the main board, and thermal conductivity of the thermal conductive underfill is greater than or equal to 0.5 w/m·K.