Chip Structure Heating Element for Image Sensor Temperature Uniformity
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Solution Overview
Problem
Image sensors experience temperature variations across the pixel array due to uneven heat distribution from adjacent chips, leading to image distortion and errors.
Innovation Solution
A chip structure with a heating element is designed to overlap a portion of the pixel array region, with its arrangement density configured to reduce temperature differences by heating the low-temperature areas, using temperature sensors to determine high and low temperature regions and applying heat accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heating element is added to the chip structure to heat low-temperature regions, then temperature uniformity across the pixel array is improved, but device complexity increases
Solution Approach 1:
The heating element is integrated into the lower chip structure and electrically connected to the pixel array region through existing wiring, merging the heating function with the existing sensor structure rather than adding a completely separate heating system
Solution Approach 2:
The lower chip structure acts as an intermediary carrier that holds both the heating element and the pixel array, mediating between the heat source and the sensor elements to achieve uniform temperature distribution
2Temperature
If the heating element length is increased to cover more of the pixel array region, then temperature coverage is improved, but manufacturing precision requirements increase
Solution Approach 1:
The heating element is designed with non-uniform characteristics where its width varies at different positions, with the width being greater at central positions and smaller at end positions, allowing different regions of the pixel array to receive appropriate heating coverage
Solution Approach 2:
The heating element's geometric parameters (length, width) are optimized to extend beyond the pixel array boundaries while maintaining appropriate heating distribution, with the element length being greater than the pixel array length to ensure full coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces temperature variations across the pixel array, preventing image errors and improving image quality by ensuring uniform temperature across the sensor.
Implementation Method 1
a second portion on the second side of the first lower semiconductor substrate, the first portion of the first lower chip structure comprises a gate wiring, the second portion of the first lower chip structure comprises a second side wiring and a heating element
Data Source
AI summary
A chip structure is provided. The chip structure includes: a first lower chip structure; and an upper chip structure on the first lower chip structure and having a pixel array region. The first lower chip structure includes: a first lower semiconductor substrate having a first side and a second side opposing each other; a first portion on the first side of the first lower semiconductor substrate; and a second portion on the second side of the first lower semiconductor substrate, the first portion of the first lower chip structure includes a gate wiring, the second portion of the first lower chip structure includes a second side wiring and a heating element, and the heating element is on the same plane as that of the second side wiring and has a length greater than that of the second side wiring.