Chip Holding Chamber for Thin-Die Adhesive Attachment
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Solution Overview
Problem
Existing semiconductor device manufacturing processes face challenges with the deformation and adhesion of small-thickness semiconductor chips or dice on substrates, leading to issues like air entrapment, glue spilling, and delamination, which affect electrical resistance and device performance.
Innovation Solution
A method involving a chip holding device with a sculptured formation and ducts to create a confined chamber at the interface between the semiconductor chip or die and the substrate, allowing controlled dispensing of glue to improve adhesion and reduce spilling, while also using sub-atmospheric pressure to handle the chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional glue dispensing is used on small-thickness semiconductor chips, then the attachment process is simple, but deformation and glue spilling occur leading to poor adhesion
Solution Approach 1:
A chip holding device with a chip retaining formation acts as an intermediary between the dispenser and the semiconductor chip. This device provides a confined chamber that guides glue flow and prevents spilling, while the sculptured formation on the substrate creates a controlled interface for glue application. The intermediary structure enables precise glue dispensing without requiring complex direct control mechanisms.
Solution Approach 2:
The chip holding device functions as a temporary flexible containment structure during the glue dispensing process. The device body with its open bottom allows controlled glue flow into the confined chamber, and the sculptured formation on the substrate provides a flexible interface that adapts to the chip thickness. After curing, this temporary structure is removed, leaving only the bonded chip-substrate assembly.
2Reliability
If glue is dispensed freely at the interface, then the application is simple, but glue spills over the chip surface affecting electrical resistance
Solution Approach 1:
The glue dispensing process is segmented into distinct zones: the confined chamber where glue is contained during application, the sculptured formation area on the substrate that defines the glue interface, and the chip surface that must remain free of glue. This segmentation prevents glue from spreading to areas where it would affect electrical resistance, while maintaining simple manufacturing through the structured geometry of the holding device and substrate.
Solution Approach 2:
The chip holding device serves as an intermediary that physically constrains glue flow during dispensing. The device body with its open bottom and the sculptured formation on the substrate create a controlled pathway for glue, ensuring it remains confined to the interface area. This intermediary structure eliminates the need for complex real-time monitoring or adjustment mechanisms during glue application.
3Manufacturing precision
If air is trapped during chip attachment, then the process is straightforward, but adhesion is compromised leading to delamination
Solution Approach 1:
The sculptured formation on the substrate is designed in advance to create a specific interface geometry that facilitates air evacuation during glue dispensing. The confined chamber is pre-configured with dimensions and features that guide glue flow from the dispenser, ensuring air is pushed out before the chip is fully attached. This preliminary structural preparation prevents air entrapment without requiring complex real-time air management systems.
Solution Approach 2:
The chip holding device acts as a temporary flexible shell that conforms to the chip and substrate during attachment. The device body with its open bottom allows the glue to flow in and displace air, while the sculptured formation provides a flexible interface that adapts to the chip thickness. This flexible containment structure enables complete chip-substrate contact without air pockets, and is removed after curing.
4Productivity
If attachment time is reduced for efficiency, then productivity increases, but adhesion quality may suffer
Solution Approach 1:
The chip holding device and sculptured formation are prepared in advance to enable rapid glue application. The confined chamber is pre-positioned and sized to receive the exact amount of glue needed, and the sculptured formation creates an optimal interface geometry that ensures immediate adhesion upon glue contact. This preliminary preparation allows the actual attachment step to be completed quickly without compromising adhesion quality, as the structural conditions for strong bonding are already in place.
Solution Approach 2:
The invention optimizes parameters such as the confined chamber dimensions, sculptured formation geometry, and glue dispensing rate to achieve rapid attachment. By carefully selecting these parameters, the process enables fast glue application and curing while maintaining adhesion quality. The parameters are tuned so that the glue sets quickly in the confined space, reducing attachment time without sacrificing bond strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of deformation and glue spilling, enhances adhesion, and decreases the time required for attaching semiconductor chips or dice on substrates, thereby improving the manufacturing efficiency and performance of semiconductor devices.
Implementation Method 1
arranging the chip holding device to a chip attachment location on a chip mounting substrate, wherein a cavity is formed between the at least one semiconductor chip or die and the chip mounting substrate
Data Source
AI summary
At least one semiconductor chip or die is held within at a chip retaining formation provided in a chip holding device. The chip holding device is then positioned with the at least one semiconductor chip or die arranged facing a chip attachment location in a chip mounting substrate. This positioning produces a cavity between the at least one semiconductor chip or die arranged at the chip retaining formation and the chip attachment location in the chip mounting substrate. A chip attachment material is dispensed into the cavity. Once cured, the chip attachment material attaches the at least one semiconductor chip or die onto the substrate at the chip attachment location in the chip mounting substrate.