Chip Hot-Plug Test Circuit Using a Switch Matrix
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Solution Overview
Problem
Existing battery management chips face challenges in effectively testing their voltage withstanding performance under hot-swapping or hot-plugging scenarios, leading to potential faults in terminal applications due to incomplete and labor-intensive manual simulation methods.
Innovation Solution
A standardized test method and apparatus using a switch matrix to connect chips to battery modules, simulating various configuration modes and working conditions to accurately and flexibly test hot-plugging performance, reducing manual intervention and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual simulation methods are used to test chip voltage withstanding performance under hot-swapping scenarios, then test flexibility is maintained, but test efficiency is low and labor intensity is high
Solution Approach 1:
The test system enables self-service testing through automated control. The switch matrix and control unit work together to automatically configure test circuits and execute test sequences without manual intervention, allowing the system to test multiple chips simultaneously in various hot-swapping scenarios, thereby dramatically improving test efficiency while eliminating labor-intensive manual simulation operations
Solution Approach 2:
The patent replaces manual mechanical simulation operations with an automated electronic control system. The control unit electronically configures the switch matrix to simulate different hot-swapping scenarios, substituting manual mechanical plug-and-play operations with automated electronic switching, which improves both test efficiency and reduces labor intensity
2Reliability
If standardized test circuits are used to test chip performance, then test reliability is improved, but test circuit complexity increases
Solution Approach 1:
The test circuit is segmented into modular functional units: switch matrix, power supply modules, load modules, and control unit. Each module performs a specific function and can be independently configured. This segmentation allows the system to achieve high test reliability through standardized connections while managing complexity through modular design, where each segment remains relatively simple but combines to form a comprehensive test system
Solution Approach 2:
The switch matrix serves multiple functions: it configures different test circuits, connects various power supply modules to different chips, simulates hot-swapping scenarios, and enables simultaneous testing of multiple chips. This multi-functionality reduces the need for multiple dedicated test circuits, thereby improving test reliability through standardization while avoiding excessive circuit complexity
3Measurement precision
If comprehensive hot-plugging test scenarios are implemented, then chip performance testing accuracy is improved, but test time increases
Solution Approach 1:
The system enables continuous testing by automatically sequencing through multiple hot-plugging scenarios without interruption. The control unit manages continuous test execution across multiple chips and scenarios, eliminating idle time between tests. This continuous operation maintains high measurement precision through comprehensive scenario coverage while minimizing total test time through efficient utilization of test resources
Solution Approach 2:
The switch matrix is pre-configured with multiple test circuit configurations before testing begins. Power supply modules and load modules are pre-positioned to enable rapid scenario switching. This preliminary preparation allows the system to execute comprehensive hot-plugging test scenarios with high accuracy while reducing the time required for manual reconfiguration between tests
Data Source
AI summary
A test method and test apparatus for a chip, an upper computer, a chip, and a device. The method includes: obtaining a test circuit which is built according to a hot-plugging test bench requirement, where the test circuit includes at least one battery module and at least one chip; connecting the at least one chip to the at least one battery module; and testing performance of the at least one chip.