Elastically Deflectable Chip Housing for Vibration Decoupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Micromechanical sensors in vehicle electronics face significant challenges due to spurious accelerations and vibrations, leading to potential damage and malfunctions, with current solutions being costly and limiting installation flexibility.
Innovation Solution
A premold housing design incorporating a mechanical low-pass filter, where the part connected to the chip structure is elastically deflectable via a spring structure with a damping material, such as silicone, to decouple vibrations from the sensor element, allowing for reduced transmission of spurious accelerations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the housing is firmly connected to the support structure, then the housing provides stable support, but vibrations and spurious accelerations are transmitted to the chip structure
Solution Approach 1:
The housing is divided into a first housing part connected to the chip structure and a second housing part connected to the support structure, with the spring structure separating these parts to provide vibration isolation while maintaining structural stability
Solution Approach 2:
The spring structure acts as an intermediary element between the first housing part and the second housing part, providing elastic connection that filters vibrations and spurious accelerations while maintaining the housing's overall stability
2Object-affected harmful factors
If vibration-damped assembly measures are implemented for the entire assembly, then spurious acceleration influences are minimized, but the effort and cost increase significantly
Solution Approach 1:
The vibration filtering function is extracted from the entire assembly and concentrated into the housing structure itself, specifically into the spring structure connecting the two housing parts, thereby reducing the need for complex assembly-wide vibration damping measures
Solution Approach 2:
The housing structure provides its own vibration filtering capability through the integrated spring structure, making the system self-sufficient for vibration protection without requiring additional external vibration damping components or complex assembly procedures
3Object-affected harmful factors
If the sensor is installed at locations with low spurious acceleration, then vibration damage is reduced, but installation flexibility and location options are restricted
Solution Approach 1:
The spring structure converts harmful vibrations and spurious accelerations into elastic deformation, allowing the sensor to be installed in locations that would otherwise be unsuitable, thereby transforming previously harmful environments into acceptable installation locations
4Manufacturing precision
If the housing part connected to the chip structure is made rigid, then manufacturing precision is improved, but vibration coupling increases
Solution Approach 1:
The housing is designed with different local properties: the first housing part connected to the chip structure has localized rigidity for positioning precision, while the spring structure provides localized flexibility for vibration filtering, and the second housing part provides overall structural support
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the transmission of spurious accelerations to the chip structure, enabling the use of micromechanical sensors in a wider range of automotive applications with reduced installation constraints and lower technological effort, while maintaining robustness and flexibility.
Implementation Method 1
a part (1) of the housing, which is connected to the chip structure (2), is connected in an elastically deflectable manner to a further part (3) of the housing
Implementation Method 2
Means (5) are provided for damping the deflection of the part (1) of the housing which is connected to the chip structure (2)
Data Source
Figure 1~2
AI summary
The invention relates to a premold housing for holding a chip structure, in which a part (1) of the housing, which is connected to the chip structure (2), is connected so as to be elastically displaceable to a further part (3) of the housing which is fixed to a support structure bearing the entire housing, wherein means are available for damping (5) the displacement of the part (1) of the housing that is connected to the chip structure (2).