Chip Identification Pads for IC Assembly Unique Addressing
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Solution Overview
Problem
Existing electronic modules with multiple integrated circuits (ICs) face difficulties in uniquely identifying individual ICs for targeted communication, leading to increased design and manufacturing complexity and costs due to the need for hardwiring unique identifiers or separate controllers/integrated communication buses.
Innovation Solution
The implementation of chip identification pads on each IC with distinct electrical connection patterns, allowing a shared communication bus to enable unique identification and communication between the controller and ICs, eliminating the need for separate controllers or communication buses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hardwiring unique identifiers into ICs using non-volatile memory or fuses is implemented, then unique identification of ICs is achieved, but design and manufacturing complexity and expense increase
Solution Approach 1:
The patent extracts the identification function from the IC core and implements it externally through pad connection patterns on the packaging substrate. This separates the identification mechanism from the IC itself, allowing standard ICs to be used without modifying their internal structure or adding non-volatile memory components.
Solution Approach 2:
The packaging substrate serves multiple functions: it provides mechanical support, electrical connections, and unique identification through its pad connection pattern. This multi-functional approach eliminates the need for separate identification components, reducing overall system complexity.
2Ease of operation
If separate controllers are integrated into each IC for unique identification, then communication targeting is enabled, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the identification function into the packaging substrate rather than integrating separate controllers into each IC. The substrate acts as a central intelligence point that can identify and address multiple ICs based on their pad connection patterns, eliminating the need for redundant controllers.
Solution Approach 2:
The packaging substrate serves as an intermediary between the controller and multiple ICs. It receives communication signals, determines which IC should receive the message based on pad connection patterns, and routes signals accordingly, replacing the need for individual controllers in each IC.
3Ease of operation
If separate communication buses are provided for each IC, then unique communication is achieved, but device complexity and manufacturing expense increase
Solution Approach 1:
The patent implements a universal communication bus that can address multiple ICs through the packaging substrate's intelligence. The same physical bus serves all ICs, while the substrate's pad connection patterns enable logical separation and targeted communication, replacing the need for multiple dedicated buses.
Data Source
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AI summary
Chip identification pads for identification of integrated circuits in an assembly. In one example embodiment, an integrated circuit (IC) assembly includes a controller, a plurality of ICs, a shared communication bus connecting the controller to the plurality of ICs and configured to enable communication between the controller and each of the plurality of ICs, and a set of one or more chip identification pads formed on each IC. Each set of chip identification pads has an electrical connection pattern. The electrical connection pattern of each set is distinct from the electrical connection pattern on every other set. Each distinct electrical connection pattern represents a unique identifier of the corresponding IC thereby enabling the controller to distinguish between the ICs.