Chip Image Correction for Defect Detection
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Solution Overview
Problem
Current methods for identifying defects or anomalies in semiconductor chips are limited, as conventional automatic test equipment relies on statistical screening and burn-in testing without effectively utilizing chip imaging, making it difficult to discern defects from normal variations.
Innovation Solution
A method and system that obtain image data of wafers or chips using thermal, photon, or magnetic imaging, correct for normal variations, and compare the data to standardized images to detect defects or anomalies, thereby categorizing chips based on fabrication quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If chip imaging techniques (thermal, photon, magnetic) are used to detect defects, then additional information about defects and anomalies is obtained, but the images show high variability making it nearly impossible to discern defects from normal behavior
Solution Approach 1:
The system performs preliminary actions by obtaining reference images of chips known to be free of defects before actual defect detection. These reference images are stored and used as a baseline for comparison, allowing the system to account for normal variations in chip imaging and accurately identify anomalies in subsequent inspections.
Solution Approach 2:
The system implements feedback by comparing obtained chip images against stored reference images and using the comparison results to identify defects. The system continuously refines its detection capabilities by learning from previous comparisons and adjusting its analysis to better distinguish between normal variations and actual defects.
2Reliability
If conventional automatic test equipment with full complement of electronic testing probes is used, then electrical failures can be detected, but defects that do not cause testable electrical failures cannot be identified
Solution Approach 1:
The system introduces an intermediary approach by using imaging techniques as a supplement to conventional electrical testing. The imaging system acts as a mediator that can detect physical anomalies and defects that electrical tests cannot identify, providing a complementary detection mechanism that enhances overall reliability assessment.
Solution Approach 2:
The system replaces or supplements the mechanical/electrical testing approach with imaging-based detection. Instead of relying solely on physical contact probes and electrical signals, the system uses non-contact imaging methods (thermal, photon, or magnetic) to detect defects, thereby extending detection capabilities to non-electrical failures.
3Device complexity
If statistical screening and burn-in testing are used without chip imaging, then the process remains simple, but defect identification efficiency is limited
Solution Approach 1:
The system achieves multi-functionality by integrating imaging capabilities that serve multiple purposes: detecting defects, analyzing chip characteristics, and providing visual documentation. This single imaging system replaces or supplements multiple separate testing procedures, maintaining simplicity while enhancing defect identification efficiency through its versatile detection capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances chip reliability and performance by effectively detecting potential defects or anomalies that could lead to future failures, overcoming the variability inherent in chip imaging and improving the efficiency of defect identification.
Implementation Method 1
the imaging techniques may include detecting heat signatures (e.g., thermal imaging)
Implementation Method 2
the imaging techniques may include detecting heat signatures (e.g., thermal imaging), photon signatures (e.g., photon imaging)
Implementation Method 3
the imaging techniques may include detecting heat signatures (e.g., thermal imaging), photon signatures (e.g., photon imaging), and/or magnetic signatures (e.g., magnetic imaging)
Data Source
AI summary
Systems and methods are provided for developing usable chip images in order to detect and screen defects or anomalies in a manufacturing environment. More specifically, a method is provided for manufacturing at least one wafer or chip. The method includes obtaining image data of the at least one wafer or chip. The method further includes correcting the image data to remove normal variation within the image data. The method further includes comparing the corrected image data to image data for at least one other wafer or chip to determine whether the corrected image data for the at least one wafer or chip shows a defect or anomaly beyond that of the normal variation. The method further includes placing the at least one wafer or chip into a category of fabrication based on the comparison.