Chip Impregnation Vessel Fluid Level Control

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Solution Overview

Problem

Conventional methods for impregnating chips in pulp manufacturing require large quantities of steam, leading to energy consumption and the generation of malodorous non-condensable gases, which are difficult to manage and pose explosion risks.

Innovation Solution

A method where impregnation fluid is added at a temperature of 90-115°C to the surface of the chips in the impregnation vessel, allowing limited steam treatment only above the fluid level, enabling the chips to sink without continuous steam expulsion of gases, thus reducing steam usage and gas emissions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If large quantities of steam are used for chip treatment, then chips are properly heated and air is expelled, but energy consumption increases and malodorous gases are generated

Engineering Contradiction:
Improvechip temperatureVSAvoidsteam consumption
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The chips undergo preliminary heating in the chip bin before entering the impregnation vessel. This pre-heating prepares the chips for subsequent processing, reducing the need for extensive steam treatment later in the process.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The harmful function of continuous steam treatment is eliminated by extracting the essential function (heating and air expulsion) and performing it only where necessary - in the chip bin before impregnation, rather than continuously during the entire process.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If continuous steam treatment is applied, then chips remain properly treated, but malodorous non-condensable gases are expelled requiring expensive management systems

Engineering Contradiction:
Improvechip treatment qualityVSAvoidmalodorous gas emissions
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The limited steam treatment in the chip bin actually benefits the process by heating chips without generating excessive malodorous gases. The harmful continuous steam treatment is converted into a beneficial limited treatment that achieves the same chip preparation function with fewer side effects.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

Instead of applying steam treatment excessively throughout the entire process, the invention applies partial steam treatment only in the chip bin, which is sufficient to heat chips and expel air without generating excessive harmful gases.

Inventive Principle:
Principle #16Partial or excessive action

3Device complexity

If steam treatment vessel is integrated with impregnation vessel, then system complexity is reduced, but control of steam treatment becomes difficult

Engineering Contradiction:
Improvesystem structureVSAvoidsteam treatment control
Core Design Contradiction:
Device complexityVSEase of operation

Solution Approach 1:

The system is segmented into distinct functional zones: a chip bin for steam treatment and an impregnation vessel for fluid impregnation. This segmentation maintains operational control while achieving a more integrated and simpler overall system compared to separate vessels.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach minimizes steam consumption, eliminates the need for expensive gas management systems, and ensures efficient chip sinking in the impregnation fluid, maintaining ambient temperature at the chip surface and reducing malodorous gas production.

Implementation Method 1

adding impregnation fluid in connection with the fluid level ±1 m at such a quantity and at such a temperature that the temperature which is established at the fluid level lies within the interval 90-115° C.

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

evaporation of fluid takes place up into the superior bed of chips locally above the fluid level

Methodology Applied
Scientific EffectEvaporation: Evaporation

Data Source

PatentUS7901541B2Method and arrangement for impregnating chips
Publication Date: 2011.03.08 METABO PAPER SWEDEN AB
  • US7901541B2 patent drawing
  • US7901541B2 patent drawing

AI summary

The method is for the impregnation of chips during the manufacture of chemical pulp. The chips are continuously fed without preceding steam treatment to the top of an impregnation vessel that maintains atmospheric pressure. Impregnation fluid (BL) is added to the impregnation vessel and establishes a fluid level (LIQ_LEV). The chips that have been added establish a chips level (CH_LEV) that lies at least 3-5 meters over the fluid level. The temperature at the top of the vessel essentially corresponds to ambient temperature.Impregnation fluid BL is fed in to the impregnation vessel in such an amount and at such a temperature that the temperature that is established at the fluid level (LIQ_LEV) is established within the interval 90-115° C., preferably within the interval 95-105° C.