Chip-to-Chip Inductive Communication for Position and Vibration Sensing
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Solution Overview
Problem
Existing information processing apparatuses lack a sensing function, necessitating additional connection of a sensing device to detect state quantities such as changes in relative position, vibration, pressure, or temperature.
Innovation Solution
An information processing apparatus comprising at least two chips with inductive coupling, where one chip transmits a signal and the other detects voltage or current changes to sense relative position, vibration, pressure, or temperature changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wireless communication between chips is implemented using inductive coupling, then communication flexibility and adaptability to mounting shape variations are improved, but the device lacks sensing function requiring additional sensing devices
Solution Approach 1:
The patent makes the transmitting and receiving coils serve dual functions: wireless communication and sensing. The same coils used for inductive coupling communication can detect changes in their electrical characteristics (inductance, resistance, Q-factor) caused by environmental factors such as temperature, pressure, vibration, or proximity to other objects. This eliminates the need for separate sensing devices and integrates multiple functions into a single system.
2Measurement precision
If additional sensing devices are connected to detect state quantities, then sensing capability is improved, but device complexity and connection requirements increase
Solution Approach 1:
The patent combines the sensing function with the existing communication coils. By monitoring changes in the electrical characteristics of the transmitting and receiving coils during wireless communication, the system can detect state quantities such as temperature, pressure, vibration, and positional changes. This merging of communication and sensing functions into a single component eliminates the need for additional sensing devices and their associated connections.
3Device complexity
If sensing function is integrated into the chip, then device complexity is reduced, but measurement precision may be affected
Solution Approach 1:
The patent employs self-service sensing where the communication coils themselves serve as the sensing elements. The coils monitor their own electrical characteristics (inductance, resistance, Q-factor) and use these self-measured parameters to detect environmental changes. This self-service approach maintains measurement precision by using the actual sensing components (the coils themselves) rather than separate sensing devices, while simultaneously reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables an information processing apparatus with integrated sensing and processing functions, allowing detection of state quantities without additional sensing devices.
Implementation Method 1
the first chip and the second chips are positioned in close proximity to each other that enables wireless communication through inductive coupling
Implementation Method 2
a second receiving coil capable of receiving the transmission signal by being inductively coupled with the first transmitting coil and a second detection portion configured to detect a voltage or current applied to the second receiving coil
Data Source
AI summary
An apparatus includes first and second chips. The first chip includes a first transmission control portion to generate a transmission signal, and a first transmitting coil connected to the first transmission control portion to transmit the transmission signal. The second chip includes a second receiving coil capable of receiving the transmission signal by being inductively coupled with the first transmitting coil, and a second detection portion to detect a voltage or current applied to the second receiving coil. The first and second chips are in close proximity to enable wireless communication through inductive coupling. The second detection portion is configured to detect, when a change in voltage or current occurring in the second receiving coil satisfies a predetermined condition, a change in relative position between the first chip and the second chip, or vibration applied to the first and second chips, pressure change, temperature change, or electromagnetic wave.